JPS5512113A - Adhesive composition - Google Patents
Adhesive compositionInfo
- Publication number
- JPS5512113A JPS5512113A JP8355078A JP8355078A JPS5512113A JP S5512113 A JPS5512113 A JP S5512113A JP 8355078 A JP8355078 A JP 8355078A JP 8355078 A JP8355078 A JP 8355078A JP S5512113 A JPS5512113 A JP S5512113A
- Authority
- JP
- Japan
- Prior art keywords
- amine
- compound
- groups
- adhesive composition
- total number
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: To prepare an adhesive composition having excellent heat stability, water resistance etc., and useful for the adhesion of aluminum honeycomb structure, etc. by mixing a specific amine-terminated prepolymer, an amine compound having two or more amine groups, and a bisimide compound.
CONSTITUTION: An adhesive composition composed of (A) an amine-terminated prepolymer obtained by reacting (a) an epoxy compound having two or more epoxy groups with (b) an amine compound having two or more amine groups, (B) an amine compound having two or more amine groups, and (C) a compound of formula IV, wherein the amounts of (a), (b), (A), (B) and (C) satisfy formulas I, II and III [E is total number of epoxy groups in (a): A1 is total nymber of amie groups in (b); A2 is total number of amine groups added to the component (A); H is number of active hydrogen atoms in (A) and (B); and B is total number of double bonds in an N,N-bisimide compound of formula IV (D is organic group containing an ethylenic C-C double bond; A is two- or more-functional organic group)].
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8355078A JPS5512113A (en) | 1978-07-11 | 1978-07-11 | Adhesive composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8355078A JPS5512113A (en) | 1978-07-11 | 1978-07-11 | Adhesive composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5512113A true JPS5512113A (en) | 1980-01-28 |
Family
ID=13805608
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8355078A Pending JPS5512113A (en) | 1978-07-11 | 1978-07-11 | Adhesive composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5512113A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023000582A1 (en) * | 2021-07-19 | 2023-01-26 | 沃顿科技股份有限公司 | Preparation method for two-component epoxy resin adhesive and two-component epoxy resin adhesive prepared thereby |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5017500A (en) * | 1973-06-16 | 1975-02-24 |
-
1978
- 1978-07-11 JP JP8355078A patent/JPS5512113A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5017500A (en) * | 1973-06-16 | 1975-02-24 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023000582A1 (en) * | 2021-07-19 | 2023-01-26 | 沃顿科技股份有限公司 | Preparation method for two-component epoxy resin adhesive and two-component epoxy resin adhesive prepared thereby |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS54151570A (en) | Selectively permeable composite membrane and its manufacture | |
CA2309699A1 (en) | Water compatible curing agents for epoxy resins | |
JPS56103224A (en) | Preparation of epoxy-modified silicone resin | |
JPS56151777A (en) | Production of cathode-deposition type electrocoating | |
ATE64927T1 (en) | RESIN SOLUTIONS FOR PUTTY AND COATING COMPOUNDS, PROCESS FOR THEIR PREPARATION AND THEIR USE. | |
JPS5512113A (en) | Adhesive composition | |
JPS6456721A (en) | Epoxy resin composition and semiconductor device coated and sealed therewith | |
JPS57202318A (en) | Curable resin composition | |
JPS52139199A (en) | Novel epoxy resin compositions | |
JPS572328A (en) | Composition for adhesive | |
JPS5512114A (en) | Adhesive composition | |
JPS5634774A (en) | Primer composition | |
JPS6429466A (en) | Coating resin composition | |
JPS57212226A (en) | Resin composition | |
JPS5620023A (en) | Curable composition | |
JPS56115362A (en) | Coating material | |
JPS5560572A (en) | Cathode-deposition-type electrodeposition coating composition | |
DK20886A (en) | IMIDAZOLD DERIVATIVES, THEIR PREPARATION AND THERAPEUTIC APPLICATION | |
JPS5329387A (en) | Polymerizable composition | |
JPS5319400A (en) | Bituminous epoxy resin compositions | |
JPS5476697A (en) | Epoxy resin composition | |
JPS56147842A (en) | Resin composition | |
JPS6433118A (en) | Epoxy resin composition and its cured product | |
JPS54148099A (en) | Resin composition having improved adhesiveness | |
JPS5527330A (en) | Acrylonitrile-butadiene-styrene resin composition having improved weather resistance and low-temperature resistance |