JPS54148099A - Resin composition having improved adhesiveness - Google Patents

Resin composition having improved adhesiveness

Info

Publication number
JPS54148099A
JPS54148099A JP5699078A JP5699078A JPS54148099A JP S54148099 A JPS54148099 A JP S54148099A JP 5699078 A JP5699078 A JP 5699078A JP 5699078 A JP5699078 A JP 5699078A JP S54148099 A JPS54148099 A JP S54148099A
Authority
JP
Japan
Prior art keywords
resin composition
hexamethylenediamine
mole
acrylic acid
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5699078A
Other languages
Japanese (ja)
Inventor
Seiichi Akiyama
Hiroshi Kawamoto
Shuichi Ishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd filed Critical Asahi Chemical Industry Co Ltd
Priority to JP5699078A priority Critical patent/JPS54148099A/en
Publication of JPS54148099A publication Critical patent/JPS54148099A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prepare a resin composition having depressed toxicity, improved low temperature-adhesiveness and storage stability and capable of giving coating films having improved strength and chemical resistance, by compounding an epoxy resin with the reaction product of hexamethylenediamine with a specific acrylic acid derivative.
CONSTITUTION: A resin composition comprising (A) 1W80 parts by weight of an amide bond-containing compound prepared by reacting (a) 1 mole of hexamethylenediamine with (b) 0.2W0.7 mole of an acrylic acid derivative I or II (R1 is H or methyl; R2 is H, cyclohexyl or 1W18C alkyl; X is halogen), and (B) 100 parts by weight of an epoxy resin having two or more epoxy groups in the molecule.
COPYRIGHT: (C)1979,JPO&Japio
JP5699078A 1978-05-13 1978-05-13 Resin composition having improved adhesiveness Pending JPS54148099A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5699078A JPS54148099A (en) 1978-05-13 1978-05-13 Resin composition having improved adhesiveness

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5699078A JPS54148099A (en) 1978-05-13 1978-05-13 Resin composition having improved adhesiveness

Publications (1)

Publication Number Publication Date
JPS54148099A true JPS54148099A (en) 1979-11-19

Family

ID=13042923

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5699078A Pending JPS54148099A (en) 1978-05-13 1978-05-13 Resin composition having improved adhesiveness

Country Status (1)

Country Link
JP (1) JPS54148099A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009523876A (en) * 2006-01-17 2009-06-25 アクゾ ノーベル コーティングス インターナショナル ビー ヴィ Curing agents for epoxy functional compounds

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009523876A (en) * 2006-01-17 2009-06-25 アクゾ ノーベル コーティングス インターナショナル ビー ヴィ Curing agents for epoxy functional compounds
US8067093B2 (en) * 2006-01-17 2011-11-29 Akzo Nobel Coatings International B.V. Curing agents for epoxy-functional compounds
JP2014012837A (en) * 2006-01-17 2014-01-23 Akzo Nobel Coatings Internatl Bv Curing agent for epoxy functional compound

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