JPS55118657A - Semiconductor rectifying element - Google Patents
Semiconductor rectifying elementInfo
- Publication number
- JPS55118657A JPS55118657A JP2560579A JP2560579A JPS55118657A JP S55118657 A JPS55118657 A JP S55118657A JP 2560579 A JP2560579 A JP 2560579A JP 2560579 A JP2560579 A JP 2560579A JP S55118657 A JPS55118657 A JP S55118657A
- Authority
- JP
- Japan
- Prior art keywords
- groove
- electrode
- rough
- open end
- silicone rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To improve the adherence of a cup-shaped electrode with silicone rubber and durability thereof by forming a groove on the open end surface of the electrode and forming a rough plated layer in the groove. CONSTITUTION:After a cup-shaped electrode 11 is pressed, a groove 11d is pressed on the open end 11c. when a nickel plating layer 11b is formed by means of electrolytic plating process, rough nickel precipitate is produced on the groove 11d to become rough plated surface. An element pellet 2 is secured to the electrode 11, a rod-like electrode 3 is provided thereat, a silicon rubber 4 is filled in the electrode, and an open end is coated with the rubber. Thus, the silicone rubber is preferably adhered to the plated rough surface of the groove. Accordingly, it can prevent the separation of the silicone rubber from the groove to improve the durability thereof.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2560579A JPS55118657A (en) | 1979-03-07 | 1979-03-07 | Semiconductor rectifying element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2560579A JPS55118657A (en) | 1979-03-07 | 1979-03-07 | Semiconductor rectifying element |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55118657A true JPS55118657A (en) | 1980-09-11 |
JPS6117145B2 JPS6117145B2 (en) | 1986-05-06 |
Family
ID=12170526
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2560579A Granted JPS55118657A (en) | 1979-03-07 | 1979-03-07 | Semiconductor rectifying element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55118657A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007042900A (en) * | 2005-08-04 | 2007-02-15 | Denso Corp | Semiconductor device |
-
1979
- 1979-03-07 JP JP2560579A patent/JPS55118657A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007042900A (en) * | 2005-08-04 | 2007-02-15 | Denso Corp | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS6117145B2 (en) | 1986-05-06 |
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