JPS55115325A - Numbering method of semiconductor wafer - Google Patents

Numbering method of semiconductor wafer

Info

Publication number
JPS55115325A
JPS55115325A JP2293179A JP2293179A JPS55115325A JP S55115325 A JPS55115325 A JP S55115325A JP 2293179 A JP2293179 A JP 2293179A JP 2293179 A JP2293179 A JP 2293179A JP S55115325 A JPS55115325 A JP S55115325A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
wafer
implanted
radioactive substance
numbering method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2293179A
Other languages
Japanese (ja)
Other versions
JPS6138848B2 (en
Inventor
Takashi Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Original Assignee
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYOU LSI GIJUTSU KENKYU KUMIAI, CHO LSI GIJUTSU KENKYU KUMIAI filed Critical CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority to JP2293179A priority Critical patent/JPS55115325A/en
Publication of JPS55115325A publication Critical patent/JPS55115325A/en
Publication of JPS6138848B2 publication Critical patent/JPS6138848B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54493—Peripheral marks on wafers, e.g. orientation flats, notches, lot number

Landscapes

  • Element Separation (AREA)
  • Measurement Of Radiation (AREA)

Abstract

PURPOSE: To number a semiconductor wafer with ease and without any effect upon it by numbering through injected radioactive substance into a selected and specified region at the circumference of a semiconductor wafer.
CONSTITUTION: A semiconductor wafer 2 to be numbered is placed on the stage 1 and radioactive substance such as 241Am etc. is implanted by a ion implantating device 3. In this process when 241Am is implanted for example with strength of 200keV, it gets to a depth of approximately 30Å into the Si wafer but it does not give any effect on the wafer and on the semiconductor device formed there. Thus radioactive substance is implanted selectively into the specified region a1Wa8 of the wafer 2. And by radioactive substance being implanted only into the hatched regions a5, a8 for example, number information 00001001 that is number 9 is given.
COPYRIGHT: (C)1980,JPO&Japio
JP2293179A 1979-02-28 1979-02-28 Numbering method of semiconductor wafer Granted JPS55115325A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2293179A JPS55115325A (en) 1979-02-28 1979-02-28 Numbering method of semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2293179A JPS55115325A (en) 1979-02-28 1979-02-28 Numbering method of semiconductor wafer

Publications (2)

Publication Number Publication Date
JPS55115325A true JPS55115325A (en) 1980-09-05
JPS6138848B2 JPS6138848B2 (en) 1986-09-01

Family

ID=12096368

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2293179A Granted JPS55115325A (en) 1979-02-28 1979-02-28 Numbering method of semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS55115325A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993009565A1 (en) * 1991-10-29 1993-05-13 Komatsu Electronic Metals Co., Ltd. Apparatus for and method of manufacturing semiconductor wafer

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227351A (en) * 1975-08-27 1977-03-01 Hitachi Ltd Wafer process control system
JPS5339060A (en) * 1976-09-22 1978-04-10 Hitachi Ltd Lot number marking method to wafers

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227351A (en) * 1975-08-27 1977-03-01 Hitachi Ltd Wafer process control system
JPS5339060A (en) * 1976-09-22 1978-04-10 Hitachi Ltd Lot number marking method to wafers

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993009565A1 (en) * 1991-10-29 1993-05-13 Komatsu Electronic Metals Co., Ltd. Apparatus for and method of manufacturing semiconductor wafer

Also Published As

Publication number Publication date
JPS6138848B2 (en) 1986-09-01

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