JPS55114935A - Etching state measuring sample - Google Patents
Etching state measuring sampleInfo
- Publication number
- JPS55114935A JPS55114935A JP2277379A JP2277379A JPS55114935A JP S55114935 A JPS55114935 A JP S55114935A JP 2277379 A JP2277379 A JP 2277379A JP 2277379 A JP2277379 A JP 2277379A JP S55114935 A JPS55114935 A JP S55114935A
- Authority
- JP
- Japan
- Prior art keywords
- etching
- gold
- copper
- sample
- outside
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Analysing Materials By The Use Of Radiation (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
PURPOSE: To make it possible to measure simply the state of an etching part by forming two or more layers consisting of different kinds of material having peculiar colors on a substance.
CONSTITUTION: As a sample to measure the etching state and the etching speed for etching dependent upon ion impulse, two or more kinds of metal having peculiar colors, for example, gold 2 and copper 3 are caused to onto plate substrate 1 alternately uniformly by evaporation to form sample 4 of a multilayer structure. Next, when the etching part is seen from the upper part after the ion beam is irradiated to sample 4 to etch it, a striped pattern dependent upon the depth and the form of etching, namely, substrate 1 at the center, gold 2 outside substrate 1, copper 3 outside gold 2 and gold outside copper are seen in etched crater part 5. If thickness of gold 3 and copper 2 are measured previously, the depth of the crater can be measured by counting the number of pattern layers, and the etching speed can be calculated from the etching required time.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2277379A JPS55114935A (en) | 1979-02-28 | 1979-02-28 | Etching state measuring sample |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2277379A JPS55114935A (en) | 1979-02-28 | 1979-02-28 | Etching state measuring sample |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55114935A true JPS55114935A (en) | 1980-09-04 |
Family
ID=12091977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2277379A Pending JPS55114935A (en) | 1979-02-28 | 1979-02-28 | Etching state measuring sample |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55114935A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019082465A (en) * | 2017-09-25 | 2019-05-30 | セラ セミコンダクター エンジニアリング ラボラトリーズ リミテッド | Depth-controllable ion milling |
-
1979
- 1979-02-28 JP JP2277379A patent/JPS55114935A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019082465A (en) * | 2017-09-25 | 2019-05-30 | セラ セミコンダクター エンジニアリング ラボラトリーズ リミテッド | Depth-controllable ion milling |
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