JPS55113897A - Production of boiling heat transfer surface - Google Patents
Production of boiling heat transfer surfaceInfo
- Publication number
- JPS55113897A JPS55113897A JP2003379A JP2003379A JPS55113897A JP S55113897 A JPS55113897 A JP S55113897A JP 2003379 A JP2003379 A JP 2003379A JP 2003379 A JP2003379 A JP 2003379A JP S55113897 A JPS55113897 A JP S55113897A
- Authority
- JP
- Japan
- Prior art keywords
- heat transfer
- plating layer
- transfer substrate
- liquid
- transfer surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C3/00—Vessels not under pressure
- F17C3/02—Vessels not under pressure with provision for thermal insulation
- F17C3/10—Vessels not under pressure with provision for thermal insulation by liquid-circulating or vapour-circulating jackets
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/623—Porosity of the layers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C2201/00—Vessel construction, in particular geometry, arrangement or size
- F17C2201/06—Vessel construction using filling material in contact with the handled fluid
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C2223/00—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel
- F17C2223/01—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel characterised by the phase
- F17C2223/0146—Two-phase
- F17C2223/0153—Liquefied gas, e.g. LPG, GPL
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C2227/00—Transfer of fluids, i.e. method or means for transferring the fluid; Heat exchange with the fluid
- F17C2227/03—Heat exchange with the fluid
- F17C2227/0302—Heat exchange with the fluid by heating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Electrochemistry (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003379A JPS55113897A (en) | 1979-02-21 | 1979-02-21 | Production of boiling heat transfer surface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003379A JPS55113897A (en) | 1979-02-21 | 1979-02-21 | Production of boiling heat transfer surface |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55113897A true JPS55113897A (en) | 1980-09-02 |
Family
ID=12015747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003379A Pending JPS55113897A (en) | 1979-02-21 | 1979-02-21 | Production of boiling heat transfer surface |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55113897A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0792517A4 (en) * | 1994-11-15 | 1998-06-24 | Formfactor Inc | ELECTRIC CONTACT STRUCTURES OBTAINED BY CONFIGURATION OF A FLEXIBLE WIRE |
US6727579B1 (en) | 1994-11-16 | 2004-04-27 | Formfactor, Inc. | Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
US6778406B2 (en) | 1993-11-16 | 2004-08-17 | Formfactor, Inc. | Resilient contact structures for interconnecting electronic devices |
JPWO2008090726A1 (ja) * | 2007-01-24 | 2010-05-13 | 日本電気株式会社 | 熱交換装置 |
-
1979
- 1979-02-21 JP JP2003379A patent/JPS55113897A/ja active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6778406B2 (en) | 1993-11-16 | 2004-08-17 | Formfactor, Inc. | Resilient contact structures for interconnecting electronic devices |
US6835898B2 (en) | 1993-11-16 | 2004-12-28 | Formfactor, Inc. | Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
US7225538B2 (en) | 1993-11-16 | 2007-06-05 | Formfactor, Inc. | Resilient contact structures formed and then attached to a substrate |
EP0792517A4 (en) * | 1994-11-15 | 1998-06-24 | Formfactor Inc | ELECTRIC CONTACT STRUCTURES OBTAINED BY CONFIGURATION OF A FLEXIBLE WIRE |
US6727579B1 (en) | 1994-11-16 | 2004-04-27 | Formfactor, Inc. | Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
JPWO2008090726A1 (ja) * | 2007-01-24 | 2010-05-13 | 日本電気株式会社 | 熱交換装置 |
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