JPS5511128A - Forming method of copper plating layer for aluminum terminal contact plate surface - Google Patents

Forming method of copper plating layer for aluminum terminal contact plate surface

Info

Publication number
JPS5511128A
JPS5511128A JP8298878A JP8298878A JPS5511128A JP S5511128 A JPS5511128 A JP S5511128A JP 8298878 A JP8298878 A JP 8298878A JP 8298878 A JP8298878 A JP 8298878A JP S5511128 A JPS5511128 A JP S5511128A
Authority
JP
Japan
Prior art keywords
plate
plating layer
copper plating
aluminum
contact plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8298878A
Other languages
English (en)
Other versions
JPS5742160B2 (ja
Inventor
Hitoshi Kato
Shoji Shiga
Satoshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP8298878A priority Critical patent/JPS5511128A/ja
Publication of JPS5511128A publication Critical patent/JPS5511128A/ja
Publication of JPS5742160B2 publication Critical patent/JPS5742160B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
JP8298878A 1978-07-10 1978-07-10 Forming method of copper plating layer for aluminum terminal contact plate surface Granted JPS5511128A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8298878A JPS5511128A (en) 1978-07-10 1978-07-10 Forming method of copper plating layer for aluminum terminal contact plate surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8298878A JPS5511128A (en) 1978-07-10 1978-07-10 Forming method of copper plating layer for aluminum terminal contact plate surface

Publications (2)

Publication Number Publication Date
JPS5511128A true JPS5511128A (en) 1980-01-25
JPS5742160B2 JPS5742160B2 (ja) 1982-09-07

Family

ID=13789589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8298878A Granted JPS5511128A (en) 1978-07-10 1978-07-10 Forming method of copper plating layer for aluminum terminal contact plate surface

Country Status (1)

Country Link
JP (1) JPS5511128A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7972710B2 (en) * 2006-08-31 2011-07-05 Antaya Technologies Corporation Clad aluminum connector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7972710B2 (en) * 2006-08-31 2011-07-05 Antaya Technologies Corporation Clad aluminum connector

Also Published As

Publication number Publication date
JPS5742160B2 (ja) 1982-09-07

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