JPS55105398A - High packing density multilayer circuit board - Google Patents

High packing density multilayer circuit board

Info

Publication number
JPS55105398A
JPS55105398A JP1357179A JP1357179A JPS55105398A JP S55105398 A JPS55105398 A JP S55105398A JP 1357179 A JP1357179 A JP 1357179A JP 1357179 A JP1357179 A JP 1357179A JP S55105398 A JPS55105398 A JP S55105398A
Authority
JP
Japan
Prior art keywords
circuit board
packing density
multilayer circuit
high packing
density multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1357179A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0121638B2 (enrdf_load_stackoverflow
Inventor
Akihiro Doutani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHO LSI GIJUTSU KENKYU KUMIAI
Original Assignee
CHO LSI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHO LSI GIJUTSU KENKYU KUMIAI filed Critical CHO LSI GIJUTSU KENKYU KUMIAI
Priority to JP1357179A priority Critical patent/JPS55105398A/ja
Publication of JPS55105398A publication Critical patent/JPS55105398A/ja
Publication of JPH0121638B2 publication Critical patent/JPH0121638B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
JP1357179A 1979-02-08 1979-02-08 High packing density multilayer circuit board Granted JPS55105398A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1357179A JPS55105398A (en) 1979-02-08 1979-02-08 High packing density multilayer circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1357179A JPS55105398A (en) 1979-02-08 1979-02-08 High packing density multilayer circuit board

Publications (2)

Publication Number Publication Date
JPS55105398A true JPS55105398A (en) 1980-08-12
JPH0121638B2 JPH0121638B2 (enrdf_load_stackoverflow) 1989-04-21

Family

ID=11836846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1357179A Granted JPS55105398A (en) 1979-02-08 1979-02-08 High packing density multilayer circuit board

Country Status (1)

Country Link
JP (1) JPS55105398A (enrdf_load_stackoverflow)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5790234A (en) * 1980-11-27 1982-06-04 Honda Motor Co Ltd Automatic winker canceler
JPS5815288A (ja) * 1981-07-21 1983-01-28 日本電気株式会社 多層配線基板
JPS58219798A (ja) * 1982-06-14 1983-12-21 日本電気株式会社 多層配線基板
JPS5940598A (ja) * 1982-08-30 1984-03-06 北陸電気工業株式会社 多層化した印刷配線回路網基板の製造方法
JPS59193596A (ja) * 1983-04-18 1984-11-02 Kyodo Printing Co Ltd Ｉｃカ−ド用ｉｃモジユ−ル
JPS6035598A (ja) * 1983-04-22 1985-02-23 クレイ　リサーチ，インコーポレイテイド 高冷却効率を有する回路モジユール
JPS62195165A (ja) * 1986-02-21 1987-08-27 Nec Corp 多層配線基板
JPH02232992A (ja) * 1989-03-06 1990-09-14 Nippon Telegr & Teleph Corp <Ntt> 電子回路モジュール

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS549767A (en) * 1977-06-24 1979-01-24 Nippon Electric Co Substrate for multiilayer wiring

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS549767A (en) * 1977-06-24 1979-01-24 Nippon Electric Co Substrate for multiilayer wiring

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5790234A (en) * 1980-11-27 1982-06-04 Honda Motor Co Ltd Automatic winker canceler
JPS5815288A (ja) * 1981-07-21 1983-01-28 日本電気株式会社 多層配線基板
JPS58219798A (ja) * 1982-06-14 1983-12-21 日本電気株式会社 多層配線基板
JPS5940598A (ja) * 1982-08-30 1984-03-06 北陸電気工業株式会社 多層化した印刷配線回路網基板の製造方法
JPS59193596A (ja) * 1983-04-18 1984-11-02 Kyodo Printing Co Ltd Ｉｃカ−ド用ｉｃモジユ−ル
JPS6035598A (ja) * 1983-04-22 1985-02-23 クレイ　リサーチ，インコーポレイテイド 高冷却効率を有する回路モジユール
JPS62195165A (ja) * 1986-02-21 1987-08-27 Nec Corp 多層配線基板
JPH02232992A (ja) * 1989-03-06 1990-09-14 Nippon Telegr & Teleph Corp <Ntt> 電子回路モジュール

Also Published As

Publication number Publication date
JPH0121638B2 (enrdf_load_stackoverflow) 1989-04-21

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