JPS55100523A - Laser working optical device - Google Patents

Laser working optical device

Info

Publication number
JPS55100523A
JPS55100523A JP895979A JP895979A JPS55100523A JP S55100523 A JPS55100523 A JP S55100523A JP 895979 A JP895979 A JP 895979A JP 895979 A JP895979 A JP 895979A JP S55100523 A JPS55100523 A JP S55100523A
Authority
JP
Japan
Prior art keywords
mirror
heat exchanger
lens
dewing
radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP895979A
Other languages
Japanese (ja)
Inventor
Takayuki Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP895979A priority Critical patent/JPS55100523A/en
Publication of JPS55100523A publication Critical patent/JPS55100523A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/703—Cooling arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To readily prevent dewing damages by specifying the heat exchanger for cooling optical members. CONSTITUTION:A mirror block 4 mounted with a mirror 3 provided in laser optical path and a lens mount 6 mounted with a lens 5 are connected by way of a piping system 7 to a heat exchanger 10 consisting of a circulating pump 8, reservoir 9, radiator 11 and fan 12. Then, when the laser light 2 emitted from a laser oscillator 1 is radiated to the work through the mirror 3 and lens 5, the coolant having been cooled in the heat exchanger and having been stored suitably in the reservoir 9 is circulated through the mirror block 4 and lens mount 6 by the circulating pump 8. Since the heat exchanger 10 consists of the radiator 11 and fan 12 and coolant temperature does not become lower than atmospheric temperature, no dewing occurs in the mirror 3 and lens 5, hence damages owing to the dewing are prevented.
JP895979A 1979-01-29 1979-01-29 Laser working optical device Pending JPS55100523A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP895979A JPS55100523A (en) 1979-01-29 1979-01-29 Laser working optical device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP895979A JPS55100523A (en) 1979-01-29 1979-01-29 Laser working optical device

Publications (1)

Publication Number Publication Date
JPS55100523A true JPS55100523A (en) 1980-07-31

Family

ID=11707201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP895979A Pending JPS55100523A (en) 1979-01-29 1979-01-29 Laser working optical device

Country Status (1)

Country Link
JP (1) JPS55100523A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4555610A (en) * 1983-09-13 1985-11-26 Data Card Corporation Laser machining system
CN110091079A (en) * 2018-01-30 2019-08-06 住友重机械工业株式会社 Laser aid
US11471979B2 (en) * 2019-08-16 2022-10-18 Bystronic Laser Ag Machining apparatus for laser machining a workpiece, set of parts for a machining apparatus for laser machining a workpiece and method for laser machining a workpiece using such machining apparatus
DE102022116486A1 (en) 2022-07-01 2024-01-04 Precitec Gmbh & Co. Kg LASER PROCESSING HEAD WITH A TWO-PHASE CLOSED HEAT EXCHANGER

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4555610A (en) * 1983-09-13 1985-11-26 Data Card Corporation Laser machining system
CN110091079A (en) * 2018-01-30 2019-08-06 住友重机械工业株式会社 Laser aid
US11471979B2 (en) * 2019-08-16 2022-10-18 Bystronic Laser Ag Machining apparatus for laser machining a workpiece, set of parts for a machining apparatus for laser machining a workpiece and method for laser machining a workpiece using such machining apparatus
DE102022116486A1 (en) 2022-07-01 2024-01-04 Precitec Gmbh & Co. Kg LASER PROCESSING HEAD WITH A TWO-PHASE CLOSED HEAT EXCHANGER

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