JPS5486457A - Soldering apparatus - Google Patents

Soldering apparatus

Info

Publication number
JPS5486457A
JPS5486457A JP15476277A JP15476277A JPS5486457A JP S5486457 A JPS5486457 A JP S5486457A JP 15476277 A JP15476277 A JP 15476277A JP 15476277 A JP15476277 A JP 15476277A JP S5486457 A JPS5486457 A JP S5486457A
Authority
JP
Japan
Prior art keywords
cooling
heating
tube
chamber
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15476277A
Other languages
Japanese (ja)
Other versions
JPS5726185B2 (en
Inventor
Tamio Saito
Toshiaki Komine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15476277A priority Critical patent/JPS5486457A/en
Publication of JPS5486457A publication Critical patent/JPS5486457A/en
Publication of JPS5726185B2 publication Critical patent/JPS5726185B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Furnace Details (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: The above mentioned apparatus, carried out highly reliable and effective soldering treatment, by contacting the member to be soldered to a fixed part of circumference face and equipping heating cooling body provided heating body and flowing passage of cooling liquid in a body, in vacuum chamber.
CONSTITUTION: The member to be soldered A is placed on the contact face 16a of the heating and cooling body 16 provided in the vacuum chamber 11 and the chamber 11 is made vacuous by operating the vacuum pump 12. Residual cooling water in the cooling water flowing tube 18 is turned out by the air of the compressed gas room 24. Current turning on the heater for heating 17, is controlled by the powe source 20. Temperature of the member A is rapidly raised to soldering temperature, because both heater 17 and tube 18 are casted with the body 16 made of good heat conductive metal, in a body and is rapidly cooled after soldering. At the time of cooling, cooling water in cooling liquid vessel 23 is sent in the tube 18 by the pump 21 and as occasion demands, N2 gas etc. in the cooling gas packing room 14 are sent in the chamber 11.
COPYRIGHT: (C)1979,JPO&Japio
JP15476277A 1977-12-22 1977-12-22 Soldering apparatus Granted JPS5486457A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15476277A JPS5486457A (en) 1977-12-22 1977-12-22 Soldering apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15476277A JPS5486457A (en) 1977-12-22 1977-12-22 Soldering apparatus

Publications (2)

Publication Number Publication Date
JPS5486457A true JPS5486457A (en) 1979-07-10
JPS5726185B2 JPS5726185B2 (en) 1982-06-03

Family

ID=15591331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15476277A Granted JPS5486457A (en) 1977-12-22 1977-12-22 Soldering apparatus

Country Status (1)

Country Link
JP (1) JPS5486457A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59151492A (en) * 1983-02-17 1984-08-29 日本電信電話株式会社 Method an ddevice for soldering electronic part
WO2007074835A1 (en) * 2005-12-28 2007-07-05 Kabushiki Kaisha Toyota Jidoshokki Soldering method, semiconductor module manufacturing method and soldering apparatus
CN103071874A (en) * 2012-12-28 2013-05-01 北京英纳超导技术有限公司 Vacuum welding device and welding method for superconducting stack of high-temperature superconducting current lead

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5143304A (en) * 1974-10-11 1976-04-14 Aanorudo Gurei Robaato Gaibugasuryu nyoru saatsushinkujokenkadeseihin oshorisuru hoho
JPS5241105A (en) * 1975-09-29 1977-03-30 Masato Ebi Furnace for vacuum heat treatment

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5143304A (en) * 1974-10-11 1976-04-14 Aanorudo Gurei Robaato Gaibugasuryu nyoru saatsushinkujokenkadeseihin oshorisuru hoho
JPS5241105A (en) * 1975-09-29 1977-03-30 Masato Ebi Furnace for vacuum heat treatment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59151492A (en) * 1983-02-17 1984-08-29 日本電信電話株式会社 Method an ddevice for soldering electronic part
WO2007074835A1 (en) * 2005-12-28 2007-07-05 Kabushiki Kaisha Toyota Jidoshokki Soldering method, semiconductor module manufacturing method and soldering apparatus
KR100996396B1 (en) 2005-12-28 2010-11-24 가부시키가이샤 도요다 지도숏키 Soldering method, semiconductor module manufacturing method and soldering apparatus
CN103071874A (en) * 2012-12-28 2013-05-01 北京英纳超导技术有限公司 Vacuum welding device and welding method for superconducting stack of high-temperature superconducting current lead

Also Published As

Publication number Publication date
JPS5726185B2 (en) 1982-06-03

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