JPS5486457A - Soldering apparatus - Google Patents
Soldering apparatusInfo
- Publication number
- JPS5486457A JPS5486457A JP15476277A JP15476277A JPS5486457A JP S5486457 A JPS5486457 A JP S5486457A JP 15476277 A JP15476277 A JP 15476277A JP 15476277 A JP15476277 A JP 15476277A JP S5486457 A JPS5486457 A JP S5486457A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- heating
- tube
- chamber
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Furnace Details (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE: The above mentioned apparatus, carried out highly reliable and effective soldering treatment, by contacting the member to be soldered to a fixed part of circumference face and equipping heating cooling body provided heating body and flowing passage of cooling liquid in a body, in vacuum chamber.
CONSTITUTION: The member to be soldered A is placed on the contact face 16a of the heating and cooling body 16 provided in the vacuum chamber 11 and the chamber 11 is made vacuous by operating the vacuum pump 12. Residual cooling water in the cooling water flowing tube 18 is turned out by the air of the compressed gas room 24. Current turning on the heater for heating 17, is controlled by the powe source 20. Temperature of the member A is rapidly raised to soldering temperature, because both heater 17 and tube 18 are casted with the body 16 made of good heat conductive metal, in a body and is rapidly cooled after soldering. At the time of cooling, cooling water in cooling liquid vessel 23 is sent in the tube 18 by the pump 21 and as occasion demands, N2 gas etc. in the cooling gas packing room 14 are sent in the chamber 11.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15476277A JPS5486457A (en) | 1977-12-22 | 1977-12-22 | Soldering apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15476277A JPS5486457A (en) | 1977-12-22 | 1977-12-22 | Soldering apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5486457A true JPS5486457A (en) | 1979-07-10 |
JPS5726185B2 JPS5726185B2 (en) | 1982-06-03 |
Family
ID=15591331
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15476277A Granted JPS5486457A (en) | 1977-12-22 | 1977-12-22 | Soldering apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5486457A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59151492A (en) * | 1983-02-17 | 1984-08-29 | 日本電信電話株式会社 | Method an ddevice for soldering electronic part |
WO2007074835A1 (en) * | 2005-12-28 | 2007-07-05 | Kabushiki Kaisha Toyota Jidoshokki | Soldering method, semiconductor module manufacturing method and soldering apparatus |
CN103071874A (en) * | 2012-12-28 | 2013-05-01 | 北京英纳超导技术有限公司 | Vacuum welding device and welding method for superconducting stack of high-temperature superconducting current lead |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5143304A (en) * | 1974-10-11 | 1976-04-14 | Aanorudo Gurei Robaato | Gaibugasuryu nyoru saatsushinkujokenkadeseihin oshorisuru hoho |
JPS5241105A (en) * | 1975-09-29 | 1977-03-30 | Masato Ebi | Furnace for vacuum heat treatment |
-
1977
- 1977-12-22 JP JP15476277A patent/JPS5486457A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5143304A (en) * | 1974-10-11 | 1976-04-14 | Aanorudo Gurei Robaato | Gaibugasuryu nyoru saatsushinkujokenkadeseihin oshorisuru hoho |
JPS5241105A (en) * | 1975-09-29 | 1977-03-30 | Masato Ebi | Furnace for vacuum heat treatment |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59151492A (en) * | 1983-02-17 | 1984-08-29 | 日本電信電話株式会社 | Method an ddevice for soldering electronic part |
WO2007074835A1 (en) * | 2005-12-28 | 2007-07-05 | Kabushiki Kaisha Toyota Jidoshokki | Soldering method, semiconductor module manufacturing method and soldering apparatus |
KR100996396B1 (en) | 2005-12-28 | 2010-11-24 | 가부시키가이샤 도요다 지도숏키 | Soldering method, semiconductor module manufacturing method and soldering apparatus |
CN103071874A (en) * | 2012-12-28 | 2013-05-01 | 北京英纳超导技术有限公司 | Vacuum welding device and welding method for superconducting stack of high-temperature superconducting current lead |
Also Published As
Publication number | Publication date |
---|---|
JPS5726185B2 (en) | 1982-06-03 |
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