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1977-12-21 |
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1976-02-17 |
1977-06-07 |
Texas Instruments Incorporated |
Beryllium copper plating process
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1976-03-11 |
1978-01-03 |
Oxy Metal Industries Corporation |
Electrodeposition of palladium
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1976-11-11 |
1978-07-11 |
International Business Machines Corporation |
Method for plating palladium-nickel alloy
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1979-08-20 |
1983-08-30 |
Occidental Chemical Corporation |
Process for the electrodeposition of palladium
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1979-08-20 |
1985-05-31 |
Oxy Metal Industries Corp |
Mittel zur elektrolytischen ablagerung von metallischem palladium auf einem substrat.
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American Chemical & Refining Company Incorporated |
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American Chemical & Refining Company Incorporated |
Method and composition for electrodepositing palladium/nickel alloys
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1980-12-17 |
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Omi International Corporation |
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1980-12-17 |
1983-07-12 |
Occidental Chemical Corporation |
Composition and process for electroplating white palladium
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1981-10-06 |
1986-11-11 |
Learonal, Inc. |
Palladium plating
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1981-10-06 |
1985-10-08 |
Learonal, Inc. |
Palladium plating
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1981-12-09 |
1986-08-21 |
Siemens AG, 1000 Berlin und 8000 München |
Wäßriges Bad und Verfahren zum galvanischen Abscheiden von glänzenden und rißfreien Palladiumschichten sowie Verfahren zur Herstellung des Bades
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1982-12-10 |
1984-08-28 |
At&T Bell Laboratories |
Process for electroplating palladium
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1982-12-22 |
1984-10-23 |
Learonal, Inc. |
Electrodeposition of palladium-silver alloys
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American Chemical & Refining Company, Inc. |
Amine-containing bath for electroplating palladium
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1991-07-22 |
1993-01-19 |
At&T Bell Laboratories |
Thermal annealing of palladium alloys
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1995-05-16 |
Enthone-Omi Inc. |
Electroplating bath and process for white palladium
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2000-04-06 |
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Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages
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Green Hydrotec Inc |
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2007-07-20 |
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High speed method for plating palladium and palladium alloys
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罗门哈斯电子材料有限公司 |
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