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1975-10-30 |
1977-12-21 |
Ibm |
Method and bath for electroplating palladium on an articl
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1976-02-17 |
1977-06-07 |
Texas Instruments Incorporated |
Beryllium copper plating process
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1976-03-11 |
1978-01-03 |
Oxy Metal Industries Corporation |
Electrodeposition of palladium
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1976-11-11 |
1978-07-11 |
International Business Machines Corporation |
Method for plating palladium-nickel alloy
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1979-08-20 |
1983-08-30 |
Occidental Chemical Corporation |
Process for the electrodeposition of palladium
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CH649581A5
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1979-08-20 |
1985-05-31 |
Oxy Metal Industries Corp |
Mittel zur elektrolytischen ablagerung von metallischem palladium auf einem substrat.
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1980-09-02 |
1981-10-27 |
American Chemical & Refining Company Incorporated |
Palladium electroplating bath and process
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1980-09-19 |
1981-10-27 |
American Chemical & Refining Company Incorporated |
Method and composition for electrodepositing palladium/nickel alloys
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1980-12-17 |
1983-07-12 |
Occidental Chemical Corporation |
Composition and process for electroplating white palladium
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1980-12-17 |
1984-12-11 |
Omi International Corporation |
Electroplating bath and process for white palladium
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1981-10-06 |
1985-10-08 |
Learonal, Inc. |
Palladium plating
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1981-10-06 |
1986-11-11 |
Learonal, Inc. |
Palladium plating
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1981-12-09 |
1986-08-21 |
Siemens AG, 1000 Berlin und 8000 München |
Wäßriges Bad und Verfahren zum galvanischen Abscheiden von glänzenden und rißfreien Palladiumschichten sowie Verfahren zur Herstellung des Bades
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1982-09-09 |
1984-04-17 |
エンゲルハ−ド・コ−ポレ−シヨン |
パラジウムメツキ浴
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*
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1982-12-10 |
1984-08-28 |
At&T Bell Laboratories |
Process for electroplating palladium
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1982-12-22 |
1984-10-23 |
Learonal, Inc. |
Electrodeposition of palladium-silver alloys
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1987-09-14 |
1988-10-18 |
American Chemical & Refining Company, Inc. |
Amine-containing bath for electroplating palladium
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1991-07-22 |
1993-01-19 |
At&T Bell Laboratories |
Thermal annealing of palladium alloys
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1993-08-16 |
1995-05-16 |
Enthone-Omi Inc. |
Electroplating bath and process for white palladium
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FR2807450B1
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2000-04-06 |
2002-07-05 |
Engelhard Clal Sas |
Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages
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2007-04-13 |
2011-12-21 |
Green Hydrotec Inc |
Palladium-containing plating solution and its uses
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2007-07-20 |
2012-07-04 |
罗门哈斯电子材料有限公司 |
镀钯及镀钯合金之高速方法
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2007-07-20 |
2011-06-23 |
Rohm And Haas Electronic Materials Llc |
High speed method for plating palladium and palladium alloys
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