JPS548537B2 - - Google Patents

Info

Publication number
JPS548537B2
JPS548537B2 JP966175A JP966175A JPS548537B2 JP S548537 B2 JPS548537 B2 JP S548537B2 JP 966175 A JP966175 A JP 966175A JP 966175 A JP966175 A JP 966175A JP S548537 B2 JPS548537 B2 JP S548537B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP966175A
Other languages
Japanese (ja)
Other versions
JPS50123532A (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS50123532A publication Critical patent/JPS50123532A/ja
Publication of JPS548537B2 publication Critical patent/JPS548537B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP966175A 1974-01-23 1975-01-22 Expired JPS548537B2 (cs)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US435844A US3925170A (en) 1974-01-23 1974-01-23 Method and composition for producing bright palladium electrodepositions

Publications (2)

Publication Number Publication Date
JPS50123532A JPS50123532A (cs) 1975-09-29
JPS548537B2 true JPS548537B2 (cs) 1979-04-17

Family

ID=23730043

Family Applications (1)

Application Number Title Priority Date Filing Date
JP966175A Expired JPS548537B2 (cs) 1974-01-23 1975-01-22

Country Status (3)

Country Link
US (1) US3925170A (cs)
JP (1) JPS548537B2 (cs)
CA (1) CA1036534A (cs)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1495910A (en) * 1975-10-30 1977-12-21 Ibm Method and bath for electroplating palladium on an articl
US4028064A (en) * 1976-02-17 1977-06-07 Texas Instruments Incorporated Beryllium copper plating process
US4066517A (en) * 1976-03-11 1978-01-03 Oxy Metal Industries Corporation Electrodeposition of palladium
US4100039A (en) * 1976-11-11 1978-07-11 International Business Machines Corporation Method for plating palladium-nickel alloy
US4401527A (en) * 1979-08-20 1983-08-30 Occidental Chemical Corporation Process for the electrodeposition of palladium
CH649581A5 (de) * 1979-08-20 1985-05-31 Oxy Metal Industries Corp Mittel zur elektrolytischen ablagerung von metallischem palladium auf einem substrat.
US4297179A (en) * 1980-09-02 1981-10-27 American Chemical & Refining Company Incorporated Palladium electroplating bath and process
US4297177A (en) * 1980-09-19 1981-10-27 American Chemical & Refining Company Incorporated Method and composition for electrodepositing palladium/nickel alloys
US4392921A (en) * 1980-12-17 1983-07-12 Occidental Chemical Corporation Composition and process for electroplating white palladium
US4487665A (en) * 1980-12-17 1984-12-11 Omi International Corporation Electroplating bath and process for white palladium
US4622110A (en) * 1981-10-06 1986-11-11 Learonal, Inc. Palladium plating
US4545868A (en) * 1981-10-06 1985-10-08 Learonal, Inc. Palladium plating
DE3148788C2 (de) * 1981-12-09 1986-08-21 Siemens AG, 1000 Berlin und 8000 München Wäßriges Bad und Verfahren zum galvanischen Abscheiden von glänzenden und rißfreien Palladiumschichten sowie Verfahren zur Herstellung des Bades
JPS5967388A (ja) * 1982-09-09 1984-04-17 エンゲルハ−ド・コ−ポレ−シヨン パラジウムメツキ浴
US4468296A (en) * 1982-12-10 1984-08-28 At&T Bell Laboratories Process for electroplating palladium
US4478692A (en) * 1982-12-22 1984-10-23 Learonal, Inc. Electrodeposition of palladium-silver alloys
US4778574A (en) * 1987-09-14 1988-10-18 American Chemical & Refining Company, Inc. Amine-containing bath for electroplating palladium
US5180482A (en) * 1991-07-22 1993-01-19 At&T Bell Laboratories Thermal annealing of palladium alloys
US5415685A (en) * 1993-08-16 1995-05-16 Enthone-Omi Inc. Electroplating bath and process for white palladium
FR2807450B1 (fr) * 2000-04-06 2002-07-05 Engelhard Clal Sas Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages
TWI354716B (en) * 2007-04-13 2011-12-21 Green Hydrotec Inc Palladium-containing plating solution and its uses
US20110147225A1 (en) * 2007-07-20 2011-06-23 Rohm And Haas Electronic Materials Llc High speed method for plating palladium and palladium alloys
CN101348928B (zh) * 2007-07-20 2012-07-04 罗门哈斯电子材料有限公司 镀钯及镀钯合金之高速方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4733176B1 (cs) * 1967-01-11 1972-08-23

Also Published As

Publication number Publication date
CA1036534A (en) 1978-08-15
US3925170A (en) 1975-12-09
USB435844I5 (cs) 1975-01-28
JPS50123532A (cs) 1975-09-29

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