JPS5480680A - Semiconductor device of glass sealing - Google Patents
Semiconductor device of glass sealingInfo
- Publication number
- JPS5480680A JPS5480680A JP14835777A JP14835777A JPS5480680A JP S5480680 A JPS5480680 A JP S5480680A JP 14835777 A JP14835777 A JP 14835777A JP 14835777 A JP14835777 A JP 14835777A JP S5480680 A JPS5480680 A JP S5480680A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- electrode
- external
- pair
- bonded via
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE: To make thin, reduce the material cost, and to make easy for lead grounding, by clipping the semiconductor with external bottom surfaces of a pair of cup electrodes, and by connecting leads at the inner bottom surface of electrode.
CONSTITUTION: The device is formed with a pair of cup type electrodes made of molybdenum plate material, silicon semiconductor 2 bonded via the junction layer clipped with the external surfaces of the electrode 1, silicon substrate 2 bonded via the junction layer clipped with the external bottom surfaces of the electrode 1, glass 3 sealing the semiconductor 2 through the coating of the wall outside between the semiconductor 2 and the electrode 1, nickel coating layer 4 formed on the inner surface bottom and circumference inner surface, and lead 5 consisting of copper or copper alloy. Further, as the material of cup type electrodes, the material having thermal expansion coefficient close to the semiconductor, such as cobalt can be used.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14835777A JPS5480680A (en) | 1977-12-10 | 1977-12-10 | Semiconductor device of glass sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14835777A JPS5480680A (en) | 1977-12-10 | 1977-12-10 | Semiconductor device of glass sealing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5480680A true JPS5480680A (en) | 1979-06-27 |
Family
ID=15450938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14835777A Pending JPS5480680A (en) | 1977-12-10 | 1977-12-10 | Semiconductor device of glass sealing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5480680A (en) |
-
1977
- 1977-12-10 JP JP14835777A patent/JPS5480680A/en active Pending
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