JPS5474757A - Heat-sensitive recording head - Google Patents

Heat-sensitive recording head

Info

Publication number
JPS5474757A
JPS5474757A JP14234877A JP14234877A JPS5474757A JP S5474757 A JPS5474757 A JP S5474757A JP 14234877 A JP14234877 A JP 14234877A JP 14234877 A JP14234877 A JP 14234877A JP S5474757 A JPS5474757 A JP S5474757A
Authority
JP
Japan
Prior art keywords
substrate
heat
circuit
sensitive recording
diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14234877A
Other languages
Japanese (ja)
Inventor
Nobuhiro Ito
Hiroshi Souri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iwatsu Electric Co Ltd
Original Assignee
Iwatsu Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iwatsu Electric Co Ltd filed Critical Iwatsu Electric Co Ltd
Priority to JP14234877A priority Critical patent/JPS5474757A/en
Publication of JPS5474757A publication Critical patent/JPS5474757A/en
Pending legal-status Critical Current

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  • Electronic Switches (AREA)
  • Non-Adjustable Resistors (AREA)

Abstract

PURPOSE: To lower cost and increase density and reliability by integrally forming a heating resistor for heat-sensitive recording, isolating diode, matrix circuit, external lead terminals, etc. on a sapphire substrate.
CONSTITUTION: By making use of the Si layer formed on a sapphire substrate 1, a Si heating resistor 2, isolating diode 3 and head control circuit 11 are formed by way of a heat accumulation layer 18 such as of SiO2, etc. and further a matrix circuit 4, external lead terminals 7, wiring conductors 8, etc. are formed. A glass-reinforced epoxy printed board 12 is provided by means of an adhesive agent 13 on the back of the substrate 1 and a high heat conductivity substrate 5 is provided on the remaining back by means of an adhesive agent 6. The board 12 is bonded to the notch part 15 of the substrate 5. The circuit 11 consists of (m) row driving control circuits 11a and (n) column driving control circuits 11b and is isolated thermally from the resistor 2 together with the diode 3 by means of thermally isolating grooves 19.
COPYRIGHT: (C)1979,JPO&Japio
JP14234877A 1977-11-28 1977-11-28 Heat-sensitive recording head Pending JPS5474757A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14234877A JPS5474757A (en) 1977-11-28 1977-11-28 Heat-sensitive recording head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14234877A JPS5474757A (en) 1977-11-28 1977-11-28 Heat-sensitive recording head

Publications (1)

Publication Number Publication Date
JPS5474757A true JPS5474757A (en) 1979-06-15

Family

ID=15313269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14234877A Pending JPS5474757A (en) 1977-11-28 1977-11-28 Heat-sensitive recording head

Country Status (1)

Country Link
JP (1) JPS5474757A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60203471A (en) * 1985-01-25 1985-10-15 Ricoh Co Ltd Driver for thermal recording head
JPS61163870A (en) * 1985-01-16 1986-07-24 Mitsubishi Electric Corp Thermal head

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61163870A (en) * 1985-01-16 1986-07-24 Mitsubishi Electric Corp Thermal head
JPS60203471A (en) * 1985-01-25 1985-10-15 Ricoh Co Ltd Driver for thermal recording head

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