JPS5472241A - Adhesive for copper-plated laminate - Google Patents
Adhesive for copper-plated laminateInfo
- Publication number
- JPS5472241A JPS5472241A JP14014577A JP14014577A JPS5472241A JP S5472241 A JPS5472241 A JP S5472241A JP 14014577 A JP14014577 A JP 14014577A JP 14014577 A JP14014577 A JP 14014577A JP S5472241 A JPS5472241 A JP S5472241A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- parts
- resin
- copper
- aluminum hydroxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14014577A JPS5472241A (en) | 1977-11-22 | 1977-11-22 | Adhesive for copper-plated laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14014577A JPS5472241A (en) | 1977-11-22 | 1977-11-22 | Adhesive for copper-plated laminate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5472241A true JPS5472241A (en) | 1979-06-09 |
JPS5724826B2 JPS5724826B2 (ja) | 1982-05-26 |
Family
ID=15261908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14014577A Granted JPS5472241A (en) | 1977-11-22 | 1977-11-22 | Adhesive for copper-plated laminate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5472241A (ja) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5468840A (en) * | 1977-11-11 | 1979-06-02 | Hitachi Chem Co Ltd | Adhesive for copper-lined laminate |
-
1977
- 1977-11-22 JP JP14014577A patent/JPS5472241A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5468840A (en) * | 1977-11-11 | 1979-06-02 | Hitachi Chem Co Ltd | Adhesive for copper-lined laminate |
Also Published As
Publication number | Publication date |
---|---|
JPS5724826B2 (ja) | 1982-05-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0374514A3 (en) | Curable dielectric polyphenylene ether-polyepoxide compositions useful in printed circuit board production | |
JPS5472241A (en) | Adhesive for copper-plated laminate | |
EP1146101A4 (en) | COPPER SHEET COATED WITH ADHESIVE, LAMINATE COPPER PLATE AND PRINTED CIRCUIT BOARD HAVING THE SAME | |
JPS5468840A (en) | Adhesive for copper-lined laminate | |
JPS51119780A (en) | A composite sheet | |
JPS5437191A (en) | Preparation of phenolic resin for laminated sheet | |
JPS573802A (en) | Polyvinyl acetal for adhesive | |
IE850184L (en) | Circuit boards made of laminates | |
JPS55123626A (en) | Production of copper-plated laminate | |
JPS5437181A (en) | Preparation of copper-clad laminate | |
JPS51133383A (en) | A process for manufacturing copper-clad laminate | |
JPS5437192A (en) | Preparation of modified phenolic resin for laminated sheet | |
JPS54125285A (en) | Manufacturing of flexible printed circuit board | |
JPS5437194A (en) | Preparation of modified phenolic resin for laminated sheet | |
JPS5226586A (en) | Copper-clad laminates | |
JPS52130882A (en) | Manufacture of copper-clad laminated boards | |
GB1030446A (en) | Improvements relating to metal-clad laminates | |
JPS5474883A (en) | Preparation of copper-clad laminate | |
JPS51119781A (en) | A laminate having improved punchability | |
JPS5665064A (en) | Adhesive for copper-clad laminated sheet | |
JPS5575467A (en) | Adhesive for copper laminated plate | |
JPS5438374A (en) | Manufacture of phenolic resin laminate | |
JPS5326880A (en) | Laminated board | |
JPH07258619A (ja) | 金属箔張積層板用接着剤 | |
JPS54125236A (en) | Production of flexible plate for printed circuit |