JPS5665064A - Adhesive for copper-clad laminated sheet - Google Patents

Adhesive for copper-clad laminated sheet

Info

Publication number
JPS5665064A
JPS5665064A JP8414580A JP8414580A JPS5665064A JP S5665064 A JPS5665064 A JP S5665064A JP 8414580 A JP8414580 A JP 8414580A JP 8414580 A JP8414580 A JP 8414580A JP S5665064 A JPS5665064 A JP S5665064A
Authority
JP
Japan
Prior art keywords
adhesive
copper
laminated sheet
clad laminated
10w300pts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8414580A
Other languages
Japanese (ja)
Other versions
JPS5757508B2 (en
Inventor
Nobuo Uozu
Shin Takanezawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP8414580A priority Critical patent/JPS5665064A/en
Publication of JPS5665064A publication Critical patent/JPS5665064A/en
Publication of JPS5757508B2 publication Critical patent/JPS5757508B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE: Titled adhesive with excellent adhesion, soldering heat resistance and tracking resistance, which is prepared by the addition of TiO2 as a filler to a thermosetting resin composed of a polyvinyl butyral and a resol-type phenol formaldehyde resin.
CONSTITUTION: Titled adhesive is obtained by adding (B) 10W300pts.wt. of titanium dioxide or 10W300pts.wt. of a mixture of titanium dioxide with zirconium silicate, as a filler, to (A) 100pts.wt. of a thermosetting resin composed of a polyvinyl butyral and a resol-type phenol formaldehyde resin. It is possible to prepare, at a low cost, an adhesive of soldering heat resistance ≥260°C.20sec and peeling strength ≥1.2kg/cm.
COPYRIGHT: (C)1981,JPO&Japio
JP8414580A 1980-06-20 1980-06-20 Adhesive for copper-clad laminated sheet Granted JPS5665064A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8414580A JPS5665064A (en) 1980-06-20 1980-06-20 Adhesive for copper-clad laminated sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8414580A JPS5665064A (en) 1980-06-20 1980-06-20 Adhesive for copper-clad laminated sheet

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP1925378A Division JPS54112940A (en) 1978-02-22 1978-02-22 Adhesive for copper-clad laminate

Publications (2)

Publication Number Publication Date
JPS5665064A true JPS5665064A (en) 1981-06-02
JPS5757508B2 JPS5757508B2 (en) 1982-12-04

Family

ID=13822325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8414580A Granted JPS5665064A (en) 1980-06-20 1980-06-20 Adhesive for copper-clad laminated sheet

Country Status (1)

Country Link
JP (1) JPS5665064A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4929996A (en) * 1988-06-29 1990-05-29 Texas Instruments Incorporated Trench bipolar transistor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4929996A (en) * 1988-06-29 1990-05-29 Texas Instruments Incorporated Trench bipolar transistor

Also Published As

Publication number Publication date
JPS5757508B2 (en) 1982-12-04

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