JPS5471576A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5471576A
JPS5471576A JP13877277A JP13877277A JPS5471576A JP S5471576 A JPS5471576 A JP S5471576A JP 13877277 A JP13877277 A JP 13877277A JP 13877277 A JP13877277 A JP 13877277A JP S5471576 A JPS5471576 A JP S5471576A
Authority
JP
Japan
Prior art keywords
package
prevented
fluorine compound
compound gas
owing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13877277A
Other languages
Japanese (ja)
Inventor
Hidetaka Ikuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP13877277A priority Critical patent/JPS5471576A/en
Publication of JPS5471576A publication Critical patent/JPS5471576A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Abstract

PURPOSE: To prevent explosion of package at the fusing of metal wirings owing to overcurrent by filling a fluorine compound gas into the package.
CONSTITUTION: When overcurrent flows owing to circuit testing or external cause, the connecting wires of Al, etc. fuse and become ionized particles, which will then fly out within the hermetic sealing package. A fluorine compound gas encloses the metal ions and inactivate the same. Hence, cap melting by discharge current is prevented and explosion prevented.
COPYRIGHT: (C)1979,JPO&Japio
JP13877277A 1977-11-17 1977-11-17 Semiconductor device Pending JPS5471576A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13877277A JPS5471576A (en) 1977-11-17 1977-11-17 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13877277A JPS5471576A (en) 1977-11-17 1977-11-17 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5471576A true JPS5471576A (en) 1979-06-08

Family

ID=15229828

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13877277A Pending JPS5471576A (en) 1977-11-17 1977-11-17 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5471576A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58108756A (en) * 1981-12-22 1983-06-28 Toshiba Corp Hermetically sealed package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58108756A (en) * 1981-12-22 1983-06-28 Toshiba Corp Hermetically sealed package

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