JPS5466770A - Device for bonding wires - Google Patents

Device for bonding wires

Info

Publication number
JPS5466770A
JPS5466770A JP13391677A JP13391677A JPS5466770A JP S5466770 A JPS5466770 A JP S5466770A JP 13391677 A JP13391677 A JP 13391677A JP 13391677 A JP13391677 A JP 13391677A JP S5466770 A JPS5466770 A JP S5466770A
Authority
JP
Japan
Prior art keywords
bonding wires
wires
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13391677A
Other languages
English (en)
Other versions
JPS5751976B2 (ja
Inventor
Takeshi Hasegawa
Nobuhito Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP13391677A priority Critical patent/JPS5466770A/ja
Publication of JPS5466770A publication Critical patent/JPS5466770A/ja
Publication of JPS5751976B2 publication Critical patent/JPS5751976B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP13391677A 1977-11-08 1977-11-08 Device for bonding wires Granted JPS5466770A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13391677A JPS5466770A (en) 1977-11-08 1977-11-08 Device for bonding wires

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13391677A JPS5466770A (en) 1977-11-08 1977-11-08 Device for bonding wires

Publications (2)

Publication Number Publication Date
JPS5466770A true JPS5466770A (en) 1979-05-29
JPS5751976B2 JPS5751976B2 (ja) 1982-11-05

Family

ID=15116076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13391677A Granted JPS5466770A (en) 1977-11-08 1977-11-08 Device for bonding wires

Country Status (1)

Country Link
JP (1) JPS5466770A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS567442A (en) * 1979-06-29 1981-01-26 Hitachi Ltd Wire bonding device
JPS5943537A (ja) * 1982-09-02 1984-03-10 Mitsubishi Electric Corp ワイヤボンデイング装置
JPS6211242A (ja) * 1986-06-27 1987-01-20 Hitachi Ltd ワイヤボンデイング装置
JPS6357146U (ja) * 1986-10-01 1988-04-16

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS567442A (en) * 1979-06-29 1981-01-26 Hitachi Ltd Wire bonding device
JPS5943537A (ja) * 1982-09-02 1984-03-10 Mitsubishi Electric Corp ワイヤボンデイング装置
JPS6364053B2 (ja) * 1982-09-02 1988-12-09
JPS6211242A (ja) * 1986-06-27 1987-01-20 Hitachi Ltd ワイヤボンデイング装置
JPS6352462B2 (ja) * 1986-06-27 1988-10-19 Hitachi Ltd
JPS6357146U (ja) * 1986-10-01 1988-04-16

Also Published As

Publication number Publication date
JPS5751976B2 (ja) 1982-11-05

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