JPS5460949A - Method of indirectly coupling two parts - Google Patents

Method of indirectly coupling two parts

Info

Publication number
JPS5460949A
JPS5460949A JP11573278A JP11573278A JPS5460949A JP S5460949 A JPS5460949 A JP S5460949A JP 11573278 A JP11573278 A JP 11573278A JP 11573278 A JP11573278 A JP 11573278A JP S5460949 A JPS5460949 A JP S5460949A
Authority
JP
Japan
Prior art keywords
parts
indirectly coupling
indirectly
coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11573278A
Other languages
English (en)
Other versions
JPS6148136B2 (ja
Inventor
Burukuharuto Kurausu
Uintsuaa Manfureeto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS5460949A publication Critical patent/JPS5460949A/ja
Publication of JPS6148136B2 publication Critical patent/JPS6148136B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/24—Preliminary treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C03C27/08—Joining glass to glass by processes other than fusing with the aid of intervening metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2419/00—Buildings or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Ceramic Products (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP11573278A 1977-09-23 1978-09-20 Method of indirectly coupling two parts Granted JPS5460949A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2742921A DE2742921C2 (de) 1977-09-23 1977-09-23 Verfahren zum mittelbaren Verbinden zweier Teile durch Verschweißung zweier Metallauflagen

Publications (2)

Publication Number Publication Date
JPS5460949A true JPS5460949A (en) 1979-05-16
JPS6148136B2 JPS6148136B2 (ja) 1986-10-22

Family

ID=6019749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11573278A Granted JPS5460949A (en) 1977-09-23 1978-09-20 Method of indirectly coupling two parts

Country Status (5)

Country Link
US (1) US4196837A (ja)
EP (1) EP0001219B1 (ja)
JP (1) JPS5460949A (ja)
CA (1) CA1105248A (ja)
DE (1) DE2742921C2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012139923A (ja) * 2010-12-29 2012-07-26 Seiko Epson Corp 液体噴射ヘッド及びその製造方法、液体噴射装置、並びに圧電素子

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2742922C2 (de) * 1977-09-23 1984-03-08 Siemens AG, 1000 Berlin und 8000 München Verfahren zum mittelbaren Verbinden zweier Teile
US4273282A (en) * 1979-12-20 1981-06-16 Litton Systems, Inc. Glass-or ceramic-to-metal seals
US4895290A (en) * 1980-12-08 1990-01-23 Raytheon Company Method for bonding materials
US4752180A (en) * 1985-02-14 1988-06-21 Kabushiki Kaisha Toshiba Method and apparatus for handling semiconductor wafers
NL8801638A (nl) * 1988-06-28 1990-01-16 Philips Nv Werkwijze voor het aan elkaar bevestigen van twee lichamen.
US5073461A (en) * 1989-11-27 1991-12-17 The Dow Chemical Company Tribochemical method of producing an oxidized surface on a ceramic or metal-ceramic
US5148958A (en) * 1991-12-23 1992-09-22 Xerox Corporation Thin film vacuum cold welding system
US5549237A (en) * 1995-02-16 1996-08-27 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Apparatus and method for cold welding thin wafers to hard substrates
DE10222284B4 (de) * 2002-05-18 2008-07-03 Leoni Ag Bauteilpaarung und Verfahren zur Einstellung der Materialfließfähigkeit zumindest eines Bauteils einer Bauteilpaarung
JP5132534B2 (ja) * 2008-12-01 2013-01-30 日本電波工業株式会社 光学部品の製造方法
US9624137B2 (en) * 2011-11-30 2017-04-18 Component Re-Engineering Company, Inc. Low temperature method for hermetically joining non-diffusing ceramic materials
ITTV20120241A1 (it) * 2012-12-21 2014-06-22 Dario Toncelli Metodo ed impianto per realizzare pannelli formati con lastre incollate
ES2706877T3 (es) 2014-11-13 2019-04-01 Gerresheimer Glas Gmbh Filtro de partículas de máquina para conformar vidrio, unidad de émbolo, cabeza de soplado, soporte de cabeza de soplado y máquina para conformar vidrio adaptada a dicho filtro o que lo comprende

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR899816A (fr) * 1942-11-18 1945-06-12 Philips Nv Procédé d'application d'une couche prenant bien la soudure sur des métaux, particulièrement sur des métaux difficiles à souder
NL281894A (ja) * 1962-08-08
DE1254774B (de) * 1964-02-18 1967-11-23 Itt Ind Ges Mit Beschraenkter Verfahren zum Herstellen eines loetfreien Kontaktes an einem Halbleiter-Bauelement
FR2158503A1 (ja) * 1971-11-05 1973-06-15 Rca Corp
US3798746A (en) * 1972-10-10 1974-03-26 Rca Corp Process of making acousto-optic devices
DE2460207A1 (de) * 1974-12-19 1976-09-02 Siemens Ag Verfahren zum herstellen eines akustooptischen bauelementes oder eines breitbandigen ultraschall-bauelementes
US4037176A (en) * 1975-03-18 1977-07-19 Matsushita Electric Industrial Co., Ltd. Multi-layered substrate for a surface-acoustic-wave device
US4064550A (en) * 1976-03-22 1977-12-20 Hewlett-Packard Company High fidelity pressure transducer
US4077558A (en) * 1976-12-06 1978-03-07 International Business Machines Corporation Diffusion bonding of crystals

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012139923A (ja) * 2010-12-29 2012-07-26 Seiko Epson Corp 液体噴射ヘッド及びその製造方法、液体噴射装置、並びに圧電素子

Also Published As

Publication number Publication date
DE2742921A1 (de) 1979-04-05
EP0001219B1 (de) 1981-08-12
DE2742921C2 (de) 1985-07-11
EP0001219A1 (de) 1979-04-04
JPS6148136B2 (ja) 1986-10-22
CA1105248A (en) 1981-07-21
US4196837A (en) 1980-04-08

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