JPS5451792A - Container for miniature piezoelectric oscillator - Google Patents
Container for miniature piezoelectric oscillatorInfo
- Publication number
- JPS5451792A JPS5451792A JP11809177A JP11809177A JPS5451792A JP S5451792 A JPS5451792 A JP S5451792A JP 11809177 A JP11809177 A JP 11809177A JP 11809177 A JP11809177 A JP 11809177A JP S5451792 A JPS5451792 A JP S5451792A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- container
- cover
- glass
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
- C03C17/23—Oxides
- C03C17/245—Oxides by deposition from the vapour phase
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/15—Deposition methods from the vapour phase
- C03C2218/151—Deposition methods from the vapour phase by vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
- C03C2218/328—Partly or completely removing a coating
- C03C2218/33—Partly or completely removing a coating by etching
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
PURPOSE:To realize miniature container with reduced cost by constituting either the substrate and the cover with the transparent glass and then sealing them with indium or its alloy. CONSTITUTION:Substrate 2 is made of the substrate glass, and In2O3 is evaporated on the entire upper surface of the substrate. Then desired electrode 4 and 5 are left through etching and other methods. To prevent the electrode short, low fusing point glass 6 is provided along the outer circumference of substrate 2 with the electrode lead-out part left, and an insulating layer is formed through printing and burning. After fixing vibration bar 1, the fusing surface of In is made to touch the end surface of the convex frame at the outer circumference of cover 3 which is formed by etching the glass plate, and In7 is sticked to be cooled down. After this, substrate 2 and cover 3 are pressure-bonded together to complete the container. In this way, no formation of the metal layer is needed on the junction surface and with no soldering, making the pressure bonding available at the normal temperatures. As a result, a miniature container can be produced with a facilitated production control.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11809177A JPS5451792A (en) | 1977-09-30 | 1977-09-30 | Container for miniature piezoelectric oscillator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11809177A JPS5451792A (en) | 1977-09-30 | 1977-09-30 | Container for miniature piezoelectric oscillator |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5451792A true JPS5451792A (en) | 1979-04-23 |
Family
ID=14727765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11809177A Pending JPS5451792A (en) | 1977-09-30 | 1977-09-30 | Container for miniature piezoelectric oscillator |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5451792A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55154900A (en) * | 1979-05-17 | 1980-12-02 | Ebauches Sa | Piezooelectric resonator |
JPS5940715A (en) * | 1982-04-27 | 1984-03-06 | Toyo Commun Equip Co Ltd | Package of piezoelectric oscillator |
US5771555A (en) * | 1993-11-01 | 1998-06-30 | Matsushita Electric Industrial Co., Ltd. | Method for producing an electronic component using direct bonding |
US5847489A (en) * | 1993-01-25 | 1998-12-08 | Matsushita Electric Industrial Co., Ltd. | Piezoelectric device and a package |
US6120917A (en) * | 1993-12-06 | 2000-09-19 | Matsushita Electric Industrial Co., Ltd. | Hybrid magnetic substrate and method for producing the same |
JP2007089117A (en) * | 2005-08-24 | 2007-04-05 | Seiko Instruments Inc | Piezoelectric vibrator, oscillator, electronic component, electronic equipment, manufacturing method of piezoelectric vibrator, and manufacturing method of electronic component |
JP2007129326A (en) * | 2005-11-01 | 2007-05-24 | Seiko Instruments Inc | Piezoelectric resonator and manufacturing method thereof, oscillator, radio wave clock and electronic equipment |
-
1977
- 1977-09-30 JP JP11809177A patent/JPS5451792A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55154900A (en) * | 1979-05-17 | 1980-12-02 | Ebauches Sa | Piezooelectric resonator |
JPS5940715A (en) * | 1982-04-27 | 1984-03-06 | Toyo Commun Equip Co Ltd | Package of piezoelectric oscillator |
US5847489A (en) * | 1993-01-25 | 1998-12-08 | Matsushita Electric Industrial Co., Ltd. | Piezoelectric device and a package |
US5771555A (en) * | 1993-11-01 | 1998-06-30 | Matsushita Electric Industrial Co., Ltd. | Method for producing an electronic component using direct bonding |
US6120917A (en) * | 1993-12-06 | 2000-09-19 | Matsushita Electric Industrial Co., Ltd. | Hybrid magnetic substrate and method for producing the same |
JP2007089117A (en) * | 2005-08-24 | 2007-04-05 | Seiko Instruments Inc | Piezoelectric vibrator, oscillator, electronic component, electronic equipment, manufacturing method of piezoelectric vibrator, and manufacturing method of electronic component |
JP2007129326A (en) * | 2005-11-01 | 2007-05-24 | Seiko Instruments Inc | Piezoelectric resonator and manufacturing method thereof, oscillator, radio wave clock and electronic equipment |
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