JPS5451779A - Ic bonding device using electron beam welding - Google Patents
Ic bonding device using electron beam weldingInfo
- Publication number
- JPS5451779A JPS5451779A JP11846177A JP11846177A JPS5451779A JP S5451779 A JPS5451779 A JP S5451779A JP 11846177 A JP11846177 A JP 11846177A JP 11846177 A JP11846177 A JP 11846177A JP S5451779 A JPS5451779 A JP S5451779A
- Authority
- JP
- Japan
- Prior art keywords
- electron beam
- air
- beam welding
- bonding device
- filament
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To ensure a high-speed and high-quality welding which can be bonded to the micro area with no impurity mixed in, by making possible welding of all kinds of metals by drawing out the electron beam into the air with control.
CONSTITUTION: The electron beam is accelerated by the high voltage between filament 4, grid 5 and anode 8 and condensed through lens 7 to be led into the air through small hole 9 of anode 8. The ON/OFF of beam 12 and the current quantity are controlled by bias current source 6 provided between the filament and grid. The beam led into the air id deflected 10, and the high-quality welding is carried out in a high speed
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11846177A JPS5451779A (en) | 1977-09-30 | 1977-09-30 | Ic bonding device using electron beam welding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11846177A JPS5451779A (en) | 1977-09-30 | 1977-09-30 | Ic bonding device using electron beam welding |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5451779A true JPS5451779A (en) | 1979-04-23 |
Family
ID=14737217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11846177A Pending JPS5451779A (en) | 1977-09-30 | 1977-09-30 | Ic bonding device using electron beam welding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5451779A (en) |
-
1977
- 1977-09-30 JP JP11846177A patent/JPS5451779A/en active Pending
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