JPS5443677A - Bonding tool - Google Patents

Bonding tool

Info

Publication number
JPS5443677A
JPS5443677A JP10987977A JP10987977A JPS5443677A JP S5443677 A JPS5443677 A JP S5443677A JP 10987977 A JP10987977 A JP 10987977A JP 10987977 A JP10987977 A JP 10987977A JP S5443677 A JPS5443677 A JP S5443677A
Authority
JP
Japan
Prior art keywords
concave
pressing
face
main body
bonding tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10987977A
Other languages
Japanese (ja)
Other versions
JPS6020896B2 (en
Inventor
Masami Kiyono
Tasuku Unno
Tetsuo Hajime
Hiroshi Kato
Mikio Hirano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10987977A priority Critical patent/JPS6020896B2/en
Publication of JPS5443677A publication Critical patent/JPS5443677A/en
Publication of JPS6020896B2 publication Critical patent/JPS6020896B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To make the temperature of a pressing face uniform by providing a concave on he square plane face at the bonding tool pointed end corresponding to a semiconductor chip while positioning the concave at the center.
CONSTITUTION: Bonding tool 20 is constituted by main body 22 incorporating heater 21, fitting axis 23 protruding to the upper part of main body 22, and pressing part 24 consisting of a square protrusion which protrudes to the lower part of main body 22. This tool 20 is formed in one body by beryllia, etc., and pressing part 24 has the approximately same size as a semiconductor chip, and plane pressing face 25 is formed in the lower edge face of 24. Further, round concave 26 is provided at the center of this pressing face 25. Thus, concave 26 has a function to lower the temperature, and reduces the temperature difference of each surrounding part of pressing face 25. As a result, a sure bonding through out all areas is possible and exfoliation, etc., are not generated.
COPYRIGHT: (C)1979,JPO&Japio
JP10987977A 1977-09-14 1977-09-14 bonding tools Expired JPS6020896B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10987977A JPS6020896B2 (en) 1977-09-14 1977-09-14 bonding tools

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10987977A JPS6020896B2 (en) 1977-09-14 1977-09-14 bonding tools

Publications (2)

Publication Number Publication Date
JPS5443677A true JPS5443677A (en) 1979-04-06
JPS6020896B2 JPS6020896B2 (en) 1985-05-24

Family

ID=14521475

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10987977A Expired JPS6020896B2 (en) 1977-09-14 1977-09-14 bonding tools

Country Status (1)

Country Link
JP (1) JPS6020896B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04146636A (en) * 1990-10-09 1992-05-20 Matsushita Electric Ind Co Ltd Film carrier tape

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01156283U (en) * 1988-04-15 1989-10-26

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04146636A (en) * 1990-10-09 1992-05-20 Matsushita Electric Ind Co Ltd Film carrier tape

Also Published As

Publication number Publication date
JPS6020896B2 (en) 1985-05-24

Similar Documents

Publication Publication Date Title
JPS5443677A (en) Bonding tool
JPS5414181A (en) Semiconductor laser unit
JPS542683A (en) Semiconductor chip
JPS53124087A (en) Manufacture of semiconductor device
JPS57175929A (en) Detector for pyroelectric type infrared ray
JPS55138243A (en) Semiconductor device
JPS548571A (en) Pressure measuring device
JPS53137688A (en) Semiconductor device of mesa type
JPS5396781A (en) Integrated circuit device
JPS5338256A (en) Manufacture of carbide point emitter
JPS544568A (en) Semiconductor device and production of the same
JPS53145483A (en) Semiconductor device and production of the same
JPS5412270A (en) Integrated circuit rackage
JPS57114247A (en) Master-slice type semiconductor device
JPS5639865A (en) Rotary grindstone
JPS5318974A (en) Semiconductor device for millimeter band mixer
JPS5351968A (en) Bonding unit
JPS535574A (en) Manufacture of semiconductor device
JPS5421288A (en) Semiconductor integreted circuit
JPS53139974A (en) Semiconductor device
JPS52142389A (en) Cubic crystalline boron nitride grinding member and process for preparing the same
JPS5295973A (en) Manufacture of semiconductor unit with heat sink
JPS53117880A (en) Cramp mechanism
JPS5471569A (en) Lead frame for semiconductor device
JPS5418276A (en) Ultrasonic bonding tool