JPS5441234A - Formation method of copper film of predetermined shape on aluminum or aluminum alloy surface - Google Patents

Formation method of copper film of predetermined shape on aluminum or aluminum alloy surface

Info

Publication number
JPS5441234A
JPS5441234A JP10794777A JP10794777A JPS5441234A JP S5441234 A JPS5441234 A JP S5441234A JP 10794777 A JP10794777 A JP 10794777A JP 10794777 A JP10794777 A JP 10794777A JP S5441234 A JPS5441234 A JP S5441234A
Authority
JP
Japan
Prior art keywords
predetermined shape
copper film
aluminum
copper
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10794777A
Other languages
Japanese (ja)
Inventor
Yukinori Kutsukake
Koji Nomaki
Kuniharu Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP10794777A priority Critical patent/JPS5441234A/en
Publication of JPS5441234A publication Critical patent/JPS5441234A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

PURPOSE:To form a copper film of an accurate shape on the surface of an Al material by coating the surface with an oily substance, powder of refractories and a copper halide in a predetermined shape, followed by heating. CONSTITUTION:An oily substance such as silicone oil or fluorine oil, powder of refractories such as ceramics and a copper halide such as cuprous chloride are suitably blended to prepare a paste. This paste is coated onto the surface of Al or its alloy in a predetermined shape and heated at 400-500 deg.C for about 10min. At this time, the powder prevents the copper halide from flowing out from the predetermined shape owing to the oily substance whose viscosity is lowered by the heating. The fluorine oil releases halogen gas, breaks an oxide film on the surface of the Al material, and accelerates copper film depositing reaction. Thus, a copper film of a desired accurate shape can be formed.
JP10794777A 1977-09-09 1977-09-09 Formation method of copper film of predetermined shape on aluminum or aluminum alloy surface Pending JPS5441234A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10794777A JPS5441234A (en) 1977-09-09 1977-09-09 Formation method of copper film of predetermined shape on aluminum or aluminum alloy surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10794777A JPS5441234A (en) 1977-09-09 1977-09-09 Formation method of copper film of predetermined shape on aluminum or aluminum alloy surface

Publications (1)

Publication Number Publication Date
JPS5441234A true JPS5441234A (en) 1979-04-02

Family

ID=14472074

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10794777A Pending JPS5441234A (en) 1977-09-09 1977-09-09 Formation method of copper film of predetermined shape on aluminum or aluminum alloy surface

Country Status (1)

Country Link
JP (1) JPS5441234A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013163663A1 (en) * 2012-05-04 2013-11-07 A.B. Mikroelektronik Gesellschaft Mit Beschränkter Haftung Method for producing a metallised substrate consisting of aluminium
US11222878B2 (en) 2019-04-30 2022-01-11 Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Electronic power module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013163663A1 (en) * 2012-05-04 2013-11-07 A.B. Mikroelektronik Gesellschaft Mit Beschränkter Haftung Method for producing a metallised substrate consisting of aluminium
US11222878B2 (en) 2019-04-30 2022-01-11 Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Electronic power module
US11776940B2 (en) 2019-04-30 2023-10-03 Kyocera AVX Components (Salzburg) GmbH Electronic power module

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