JPS5437577A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5437577A JPS5437577A JP10462077A JP10462077A JPS5437577A JP S5437577 A JPS5437577 A JP S5437577A JP 10462077 A JP10462077 A JP 10462077A JP 10462077 A JP10462077 A JP 10462077A JP S5437577 A JPS5437577 A JP S5437577A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- insersion
- varying
- make
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To make the fine adjustment of an electrostatic capacity by varying an insersion area, by inserting a high dielectric into the cavity formed of a container base and wall material.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10462077A JPS5437577A (en) | 1977-08-30 | 1977-08-30 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10462077A JPS5437577A (en) | 1977-08-30 | 1977-08-30 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5437577A true JPS5437577A (en) | 1979-03-20 |
JPS6138614B2 JPS6138614B2 (en) | 1986-08-30 |
Family
ID=14385475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10462077A Granted JPS5437577A (en) | 1977-08-30 | 1977-08-30 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5437577A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5086558A (en) * | 1990-09-13 | 1992-02-11 | International Business Machines Corporation | Direct attachment of semiconductor chips to a substrate with a substrate with a thermoplastic interposer |
-
1977
- 1977-08-30 JP JP10462077A patent/JPS5437577A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5086558A (en) * | 1990-09-13 | 1992-02-11 | International Business Machines Corporation | Direct attachment of semiconductor chips to a substrate with a substrate with a thermoplastic interposer |
Also Published As
Publication number | Publication date |
---|---|
JPS6138614B2 (en) | 1986-08-30 |
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