JPS5437572A - Manufacture os semiconductor device - Google Patents
Manufacture os semiconductor deviceInfo
- Publication number
- JPS5437572A JPS5437572A JP10386077A JP10386077A JPS5437572A JP S5437572 A JPS5437572 A JP S5437572A JP 10386077 A JP10386077 A JP 10386077A JP 10386077 A JP10386077 A JP 10386077A JP S5437572 A JPS5437572 A JP S5437572A
- Authority
- JP
- Japan
- Prior art keywords
- manufacture
- semiconductor device
- heat
- circumference
- uniform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10386077A JPS597217B2 (ja) | 1977-08-29 | 1977-08-29 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10386077A JPS597217B2 (ja) | 1977-08-29 | 1977-08-29 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5437572A true JPS5437572A (en) | 1979-03-20 |
JPS597217B2 JPS597217B2 (ja) | 1984-02-17 |
Family
ID=14365193
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10386077A Expired JPS597217B2 (ja) | 1977-08-29 | 1977-08-29 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS597217B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7345369B2 (en) | 2004-10-21 | 2008-03-18 | Denso Corporation | Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5939779U (ja) * | 1982-09-06 | 1984-03-14 | 株式会社豊田自動織機製作所 | 産業車輌の冷却装置 |
JPH0475128U (ja) * | 1990-11-13 | 1992-06-30 |
-
1977
- 1977-08-29 JP JP10386077A patent/JPS597217B2/ja not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7345369B2 (en) | 2004-10-21 | 2008-03-18 | Denso Corporation | Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
JPS597217B2 (ja) | 1984-02-17 |
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