JPS5434551Y2 - - Google Patents

Info

Publication number
JPS5434551Y2
JPS5434551Y2 JP5474375U JP5474375U JPS5434551Y2 JP S5434551 Y2 JPS5434551 Y2 JP S5434551Y2 JP 5474375 U JP5474375 U JP 5474375U JP 5474375 U JP5474375 U JP 5474375U JP S5434551 Y2 JPS5434551 Y2 JP S5434551Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5474375U
Other versions
JPS51136057U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5474375U priority Critical patent/JPS5434551Y2/ja
Publication of JPS51136057U publication Critical patent/JPS51136057U/ja
Application granted granted Critical
Publication of JPS5434551Y2 publication Critical patent/JPS5434551Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP5474375U 1975-04-22 1975-04-22 Expired JPS5434551Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5474375U JPS5434551Y2 (ja) 1975-04-22 1975-04-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5474375U JPS5434551Y2 (ja) 1975-04-22 1975-04-22

Publications (2)

Publication Number Publication Date
JPS51136057U JPS51136057U (ja) 1976-11-02
JPS5434551Y2 true JPS5434551Y2 (ja) 1979-10-22

Family

ID=28205836

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5474375U Expired JPS5434551Y2 (ja) 1975-04-22 1975-04-22

Country Status (1)

Country Link
JP (1) JPS5434551Y2 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5923427Y2 (ja) * 1976-12-27 1984-07-12 富士通株式会社 モ−ルド外装電気部品のリ−ドフレ−ム
JPS5956751A (ja) * 1983-08-26 1984-04-02 Hitachi Ltd 半導体装置
JPH0739237Y2 (ja) * 1989-12-21 1995-09-06 三洋電機株式会社 半導体装置

Also Published As

Publication number Publication date
JPS51136057U (ja) 1976-11-02

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