JPS51136057U - - Google Patents
Info
- Publication number
- JPS51136057U JPS51136057U JP5474375U JP5474375U JPS51136057U JP S51136057 U JPS51136057 U JP S51136057U JP 5474375 U JP5474375 U JP 5474375U JP 5474375 U JP5474375 U JP 5474375U JP S51136057 U JPS51136057 U JP S51136057U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5474375U JPS5434551Y2 (ja) | 1975-04-22 | 1975-04-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5474375U JPS5434551Y2 (ja) | 1975-04-22 | 1975-04-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS51136057U true JPS51136057U (ja) | 1976-11-02 |
JPS5434551Y2 JPS5434551Y2 (ja) | 1979-10-22 |
Family
ID=28205836
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5474375U Expired JPS5434551Y2 (ja) | 1975-04-22 | 1975-04-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5434551Y2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5392148U (ja) * | 1976-12-27 | 1978-07-27 | ||
JPS5956751A (ja) * | 1983-08-26 | 1984-04-02 | Hitachi Ltd | 半導体装置 |
JPH0385650U (ja) * | 1989-12-21 | 1991-08-29 |
-
1975
- 1975-04-22 JP JP5474375U patent/JPS5434551Y2/ja not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5392148U (ja) * | 1976-12-27 | 1978-07-27 | ||
JPS5956751A (ja) * | 1983-08-26 | 1984-04-02 | Hitachi Ltd | 半導体装置 |
JPH0385650U (ja) * | 1989-12-21 | 1991-08-29 |
Also Published As
Publication number | Publication date |
---|---|
JPS5434551Y2 (ja) | 1979-10-22 |