JPS5434551Y2 - - Google Patents

Info

Publication number
JPS5434551Y2
JPS5434551Y2 JP1975054743U JP5474375U JPS5434551Y2 JP S5434551 Y2 JPS5434551 Y2 JP S5434551Y2 JP 1975054743 U JP1975054743 U JP 1975054743U JP 5474375 U JP5474375 U JP 5474375U JP S5434551 Y2 JPS5434551 Y2 JP S5434551Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1975054743U
Other languages
Japanese (ja)
Other versions
JPS51136057U (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1975054743U priority Critical patent/JPS5434551Y2/ja
Publication of JPS51136057U publication Critical patent/JPS51136057U/ja
Application granted granted Critical
Publication of JPS5434551Y2 publication Critical patent/JPS5434551Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1975054743U 1975-04-22 1975-04-22 Expired JPS5434551Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975054743U JPS5434551Y2 (https=) 1975-04-22 1975-04-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975054743U JPS5434551Y2 (https=) 1975-04-22 1975-04-22

Publications (2)

Publication Number Publication Date
JPS51136057U JPS51136057U (https=) 1976-11-02
JPS5434551Y2 true JPS5434551Y2 (https=) 1979-10-22

Family

ID=28205836

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975054743U Expired JPS5434551Y2 (https=) 1975-04-22 1975-04-22

Country Status (1)

Country Link
JP (1) JPS5434551Y2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5923427Y2 (ja) * 1976-12-27 1984-07-12 富士通株式会社 モ−ルド外装電気部品のリ−ドフレ−ム
JPS5956751A (ja) * 1983-08-26 1984-04-02 Hitachi Ltd 半導体装置
JPH0739237Y2 (ja) * 1989-12-21 1995-09-06 三洋電機株式会社 半導体装置

Also Published As

Publication number Publication date
JPS51136057U (https=) 1976-11-02

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