JPS5424577A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPS5424577A
JPS5424577A JP8882777A JP8882777A JPS5424577A JP S5424577 A JPS5424577 A JP S5424577A JP 8882777 A JP8882777 A JP 8882777A JP 8882777 A JP8882777 A JP 8882777A JP S5424577 A JPS5424577 A JP S5424577A
Authority
JP
Japan
Prior art keywords
lead frame
semiconductor device
frame
keepign
cuttingwork
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8882777A
Other languages
Japanese (ja)
Inventor
Tomohiro Shibata
Hiroshi Mugitani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP8882777A priority Critical patent/JPS5424577A/en
Publication of JPS5424577A publication Critical patent/JPS5424577A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To save the frame material while keepign the same function as the frame with ribs, to simplify the cuttingwork after resin sealing, and to double the manufacturing efficiency, in a lead frame for semiconductor devices.
JP8882777A 1977-07-26 1977-07-26 Lead frame for semiconductor device Pending JPS5424577A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8882777A JPS5424577A (en) 1977-07-26 1977-07-26 Lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8882777A JPS5424577A (en) 1977-07-26 1977-07-26 Lead frame for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5424577A true JPS5424577A (en) 1979-02-23

Family

ID=13953757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8882777A Pending JPS5424577A (en) 1977-07-26 1977-07-26 Lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5424577A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4944160B1 (en) * 1965-11-12 1974-11-26
JPS5040984A (en) * 1973-08-14 1975-04-15

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4944160B1 (en) * 1965-11-12 1974-11-26
JPS5040984A (en) * 1973-08-14 1975-04-15

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