JPS5422790A - Optical drive type semiconductor control device - Google Patents

Optical drive type semiconductor control device

Info

Publication number
JPS5422790A
JPS5422790A JP8807677A JP8807677A JPS5422790A JP S5422790 A JPS5422790 A JP S5422790A JP 8807677 A JP8807677 A JP 8807677A JP 8807677 A JP8807677 A JP 8807677A JP S5422790 A JPS5422790 A JP S5422790A
Authority
JP
Japan
Prior art keywords
control device
type semiconductor
drive type
optical drive
semiconductor control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8807677A
Other languages
Japanese (ja)
Other versions
JPS5858826B2 (en
Inventor
Akira Kawakami
Kiyohiko Mihara
Tsutomu Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP52088076A priority Critical patent/JPS5858826B2/en
Publication of JPS5422790A publication Critical patent/JPS5422790A/en
Publication of JPS5858826B2 publication Critical patent/JPS5858826B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Thyristors (AREA)

Abstract

PURPOSE: To avoid the local temperature increase of the thyristor and to increase the di/dt ranting, quantity, by storing previously the thyristor and plural units of the luminous element which trigger the thyristor into one package and securing a total and simultaneous turn-off for the thyristor with the light given from the luminous element.
COPYRIGHT: (C)1979,JPO&Japio
JP52088076A 1977-07-21 1977-07-21 Light-driven thyristor device Expired JPS5858826B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52088076A JPS5858826B2 (en) 1977-07-21 1977-07-21 Light-driven thyristor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52088076A JPS5858826B2 (en) 1977-07-21 1977-07-21 Light-driven thyristor device

Publications (2)

Publication Number Publication Date
JPS5422790A true JPS5422790A (en) 1979-02-20
JPS5858826B2 JPS5858826B2 (en) 1983-12-27

Family

ID=13932761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52088076A Expired JPS5858826B2 (en) 1977-07-21 1977-07-21 Light-driven thyristor device

Country Status (1)

Country Link
JP (1) JPS5858826B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06254347A (en) * 1993-03-09 1994-09-13 Nippon Shokubai Co Ltd Deodorizing method and device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5216352A (en) * 1990-11-29 1993-06-01 Square D Company Solid state current controlled interruption system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06254347A (en) * 1993-03-09 1994-09-13 Nippon Shokubai Co Ltd Deodorizing method and device

Also Published As

Publication number Publication date
JPS5858826B2 (en) 1983-12-27

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