JPS5417668A - Glass-sealed diode - Google Patents

Glass-sealed diode

Info

Publication number
JPS5417668A
JPS5417668A JP8224377A JP8224377A JPS5417668A JP S5417668 A JPS5417668 A JP S5417668A JP 8224377 A JP8224377 A JP 8224377A JP 8224377 A JP8224377 A JP 8224377A JP S5417668 A JPS5417668 A JP S5417668A
Authority
JP
Japan
Prior art keywords
glass
sealed diode
electrode
glass tube
dumet wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8224377A
Other languages
Japanese (ja)
Inventor
Toshiyuki Shikanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8224377A priority Critical patent/JPS5417668A/en
Publication of JPS5417668A publication Critical patent/JPS5417668A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To reduce the cost of a semiconductor by pressure-inserting and directly fixing a dumet wire fusion-fixed to a glass tube to one electrode of a diode sealed in the glass tube, and a dumet wire wound with lead glass to the other electrode.
COPYRIGHT: (C)1979,JPO&Japio
JP8224377A 1977-07-08 1977-07-08 Glass-sealed diode Pending JPS5417668A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8224377A JPS5417668A (en) 1977-07-08 1977-07-08 Glass-sealed diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8224377A JPS5417668A (en) 1977-07-08 1977-07-08 Glass-sealed diode

Publications (1)

Publication Number Publication Date
JPS5417668A true JPS5417668A (en) 1979-02-09

Family

ID=13768969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8224377A Pending JPS5417668A (en) 1977-07-08 1977-07-08 Glass-sealed diode

Country Status (1)

Country Link
JP (1) JPS5417668A (en)

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