JPS54153837A - Composite adhesive sheet and its manufacturing method - Google Patents

Composite adhesive sheet and its manufacturing method

Info

Publication number
JPS54153837A
JPS54153837A JP6204678A JP6204678A JPS54153837A JP S54153837 A JPS54153837 A JP S54153837A JP 6204678 A JP6204678 A JP 6204678A JP 6204678 A JP6204678 A JP 6204678A JP S54153837 A JPS54153837 A JP S54153837A
Authority
JP
Japan
Prior art keywords
sheet
resin
melting point
composite adhesive
adhesive sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6204678A
Other languages
Japanese (ja)
Other versions
JPS5831113B2 (en
Inventor
Norio Kawamoto
Katsufumi Shimokubo
Kazuhiro Tajiri
Makoto Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP53062046A priority Critical patent/JPS5831113B2/en
Publication of JPS54153837A publication Critical patent/JPS54153837A/en
Publication of JPS5831113B2 publication Critical patent/JPS5831113B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: To manufacture a composite adhesive sheet having excellent adhesive strength, without using solvents and fiber substrate, by coating a fusible sheet with a powdery resin having a melting point lower than that of the sheet.
CONSTITUTION: A sheet substrate which is solid at room temperature, e.g. made of polyethylene, ethylene-vinyl acetate copolymer, polyester, etc., is sprayed with powdery resin having an average particle size of 5W1000μ, and a melting point lower than that of the sheet, e.g. powders of a thermoplastic resin such as polyethylene, nylon, etc., and a thermosetting resin such as epoxy resin, etc., by electrostatic spraying, scattering, etc., and heated at a temperature between the melting point of the sheet and the melting point of the resin powder, thereby fusing and fixing the powder to the sheet.
COPYRIGHT: (C)1979,JPO&Japio
JP53062046A 1978-05-23 1978-05-23 Composite adhesive sheet and its usage Expired JPS5831113B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53062046A JPS5831113B2 (en) 1978-05-23 1978-05-23 Composite adhesive sheet and its usage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53062046A JPS5831113B2 (en) 1978-05-23 1978-05-23 Composite adhesive sheet and its usage

Publications (2)

Publication Number Publication Date
JPS54153837A true JPS54153837A (en) 1979-12-04
JPS5831113B2 JPS5831113B2 (en) 1983-07-04

Family

ID=13188819

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53062046A Expired JPS5831113B2 (en) 1978-05-23 1978-05-23 Composite adhesive sheet and its usage

Country Status (1)

Country Link
JP (1) JPS5831113B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55925A (en) * 1978-06-16 1980-01-07 Asahi Chem Ind Co Ltd Information input device
JPS5554376A (en) * 1978-10-17 1980-04-21 Dynic Corp Double-coated pressure-sensitive heat-sensitive adhesive sheet
JPS60225501A (en) * 1984-04-25 1985-11-09 アキレス株式会社 Laminated upper material

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59204245A (en) * 1983-05-06 1984-11-19 Mitsubishi Electric Corp Resin sealing process of semicondutor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831976A (en) * 1971-08-26 1973-04-26
JPS524455U (en) * 1975-06-24 1977-01-12
JPS524455A (en) * 1975-06-25 1977-01-13 Gen Electric Wire drawing die

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS524455B2 (en) * 1971-12-22 1977-02-04

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831976A (en) * 1971-08-26 1973-04-26
JPS524455U (en) * 1975-06-24 1977-01-12
JPS524455A (en) * 1975-06-25 1977-01-13 Gen Electric Wire drawing die

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55925A (en) * 1978-06-16 1980-01-07 Asahi Chem Ind Co Ltd Information input device
JPS5628301B2 (en) * 1978-06-16 1981-07-01
JPS5554376A (en) * 1978-10-17 1980-04-21 Dynic Corp Double-coated pressure-sensitive heat-sensitive adhesive sheet
JPS60225501A (en) * 1984-04-25 1985-11-09 アキレス株式会社 Laminated upper material

Also Published As

Publication number Publication date
JPS5831113B2 (en) 1983-07-04

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