JPS54152866A - Sealing cut method for semiconductor device - Google Patents

Abstract

PURPOSE: To prevent occurrence of the slow leak by drawing out the lead wire to outside from the semiconductor element sealed within the insulated container through the pipe and then giving the sealing cut to the pipe and lead wire after the diameter reduction is given through the pinch welding.

CONSTITUTION: Semiconductor element 1 is stuck onto basement boad 2 made of Cu and then enclosed by insulated container 3, and gate wire 4 provided to element 1 is made to pierce through gate pipe 5 and then drawn outside conatiner 3 and to be connected to gate terminal wire 7. In this case, sealing cut part 6 is formed in the middle of wire 7 to prevent the leak of the inactive gas enclosed into the container. At the same time, cathode terminal wire 8 provided to element 1 is also led outside container 3. In such constitution, part 6 is formed in the following method: Al wire 12 (gate wire) is made to pass through Ni pipe 11 as shown in the diagram; the diameter reduction is given to both pipe 11 and wire 12 by means of pinch welding electrode 16; wire 12 protruded from the pinch welding part is cut off: pinch welding 17 is given again; and the sealing cut is given to pipe 11 to be welded.

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