JPS54148476A - Semiconductor device and its manufacture - Google Patents
Semiconductor device and its manufactureInfo
- Publication number
- JPS54148476A JPS54148476A JP5780478A JP5780478A JPS54148476A JP S54148476 A JPS54148476 A JP S54148476A JP 5780478 A JP5780478 A JP 5780478A JP 5780478 A JP5780478 A JP 5780478A JP S54148476 A JPS54148476 A JP S54148476A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- type
- region
- diffusion
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Bipolar Transistors (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE: To increase the adhesive force when the back surface of the semiconductor substrate containing each element region formed is adhered to a container or the lead frame by removing the layer containing the P- and N-type impurities occurring on the back surface and then providing newly the high-density layer of thd same conducting type as the substrate.
CONSTITUTION: N-type buried region 2 is formed by diffusion on P-type semiconductor substrate 1, and then N-type layer 3 is epitaxial-grown on the entire surface including region 2. Then P- type region 4 reaching up to substrate 1 is formed by diffusion at layer 3 to isolate layer 3 into an island form. After this, P-type base region 5 is formed by diffusion within isolated layer 3, N-type emitter region 6 is provided within region 5, N-type collector contact region 7 is formed by diffusion at the place distant away from region 5, and the entire surface is covered with SiO2 film 8. Then the aperture is drilled to film 8 with attachment of electrode 9 at each region. At the same time, layer 10 is polished away from the back surface of substrate 1, and layer 10 contains both N- and P-type impurities which are caused during the above processes. As layer 10 which has the inferior adhesion to the container is removed away and P-type layer 11 of a high impurity density is added, the adhesive performance can be enhanced extremely.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5780478A JPS54148476A (en) | 1978-05-15 | 1978-05-15 | Semiconductor device and its manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5780478A JPS54148476A (en) | 1978-05-15 | 1978-05-15 | Semiconductor device and its manufacture |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54148476A true JPS54148476A (en) | 1979-11-20 |
JPS6136373B2 JPS6136373B2 (en) | 1986-08-18 |
Family
ID=13066094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5780478A Granted JPS54148476A (en) | 1978-05-15 | 1978-05-15 | Semiconductor device and its manufacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54148476A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6054653A (en) * | 1998-01-28 | 2000-04-25 | Hansen; Gregory Robert | Apparatus for attaching a surface mount component |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5179563A (en) * | 1975-01-06 | 1976-07-10 | Hitachi Ltd | HANDOTAISOCHINOSEIZOHOHO |
-
1978
- 1978-05-15 JP JP5780478A patent/JPS54148476A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5179563A (en) * | 1975-01-06 | 1976-07-10 | Hitachi Ltd | HANDOTAISOCHINOSEIZOHOHO |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6054653A (en) * | 1998-01-28 | 2000-04-25 | Hansen; Gregory Robert | Apparatus for attaching a surface mount component |
Also Published As
Publication number | Publication date |
---|---|
JPS6136373B2 (en) | 1986-08-18 |
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