JPS54145332A - Electroforming method - Google Patents

Electroforming method

Info

Publication number
JPS54145332A
JPS54145332A JP5329678A JP5329678A JPS54145332A JP S54145332 A JPS54145332 A JP S54145332A JP 5329678 A JP5329678 A JP 5329678A JP 5329678 A JP5329678 A JP 5329678A JP S54145332 A JPS54145332 A JP S54145332A
Authority
JP
Japan
Prior art keywords
electrodeposition
hole
uniform
photosensitive
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5329678A
Other languages
Japanese (ja)
Inventor
Koichi Yoneyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5329678A priority Critical patent/JPS54145332A/en
Publication of JPS54145332A publication Critical patent/JPS54145332A/en
Pending legal-status Critical Current

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  • Printing Plates And Materials Therefor (AREA)

Abstract

PURPOSE: To obtain uniform thickness of metal part crystallized by electrodeposition by forming small circular holes other than a hole of the shape of part in a photosensitive and chemical resistant film coated on a base plate.
CONSTITUTION: The photosensitive and chemical resistant film 12 is coated on the matrix metal base plate 11, exposed to light by photographic processing, and then removed by dissolution by a developing solution to form the hole 13 of the shape of part. At the same time, a plural number of small circular holes 14 in such a way that ratio of the base plate exposed area of the hole 13 portion to the insulating area of the photosensitive and chemical resistant film 12 is almost uniform. Thus, current line in electrodeposition process is distributed even into the small circular hole 14, whereby the current density in a portion of a broad exposure width becomes similar to that in a portion of a shallow exposure width and thus the thickness of crystallized metal part becomes uniform. In addition, electrodeposition stress becomes almost constant and thus the control of electrodeposition stress can be made easier by electrodeposition conditions. Furthermore, no secondary processing such as buffing, etc., is required because of uniform crystallization of metal part.
COPYRIGHT: (C)1979,JPO&Japio
JP5329678A 1978-05-06 1978-05-06 Electroforming method Pending JPS54145332A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5329678A JPS54145332A (en) 1978-05-06 1978-05-06 Electroforming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5329678A JPS54145332A (en) 1978-05-06 1978-05-06 Electroforming method

Publications (1)

Publication Number Publication Date
JPS54145332A true JPS54145332A (en) 1979-11-13

Family

ID=12938752

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5329678A Pending JPS54145332A (en) 1978-05-06 1978-05-06 Electroforming method

Country Status (1)

Country Link
JP (1) JPS54145332A (en)

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