JPS54126284A - Preparation of laminate board having metal layer to be corroded - Google Patents
Preparation of laminate board having metal layer to be corrodedInfo
- Publication number
- JPS54126284A JPS54126284A JP3380278A JP3380278A JPS54126284A JP S54126284 A JPS54126284 A JP S54126284A JP 3380278 A JP3380278 A JP 3380278A JP 3380278 A JP3380278 A JP 3380278A JP S54126284 A JPS54126284 A JP S54126284A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- metal foil
- corroded
- metal layer
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53033802A JPS6042026B2 (ja) | 1978-03-24 | 1978-03-24 | 金属箔腐蝕積層板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53033802A JPS6042026B2 (ja) | 1978-03-24 | 1978-03-24 | 金属箔腐蝕積層板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54126284A true JPS54126284A (en) | 1979-10-01 |
JPS6042026B2 JPS6042026B2 (ja) | 1985-09-19 |
Family
ID=12396598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53033802A Expired JPS6042026B2 (ja) | 1978-03-24 | 1978-03-24 | 金属箔腐蝕積層板の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6042026B2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4689110A (en) * | 1983-12-22 | 1987-08-25 | Trw Inc. | Method of fabricating multilayer printed circuit board structure |
TWI397473B (zh) * | 2009-11-25 | 2013-06-01 | Samsung Electro Mech | 核心基材及製造核心基材之方法 |
TWI401158B (zh) * | 2006-06-30 | 2013-07-11 | Sumitomo Chemical Co | 包含液晶性聚酯層之積層板的製造方法 |
-
1978
- 1978-03-24 JP JP53033802A patent/JPS6042026B2/ja not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4689110A (en) * | 1983-12-22 | 1987-08-25 | Trw Inc. | Method of fabricating multilayer printed circuit board structure |
TWI401158B (zh) * | 2006-06-30 | 2013-07-11 | Sumitomo Chemical Co | 包含液晶性聚酯層之積層板的製造方法 |
TWI397473B (zh) * | 2009-11-25 | 2013-06-01 | Samsung Electro Mech | 核心基材及製造核心基材之方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6042026B2 (ja) | 1985-09-19 |
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