JPS54112166A - Method and device for cutting semiconductor wafer - Google Patents

Method and device for cutting semiconductor wafer

Info

Publication number
JPS54112166A
JPS54112166A JP2010678A JP2010678A JPS54112166A JP S54112166 A JPS54112166 A JP S54112166A JP 2010678 A JP2010678 A JP 2010678A JP 2010678 A JP2010678 A JP 2010678A JP S54112166 A JPS54112166 A JP S54112166A
Authority
JP
Japan
Prior art keywords
wafer
cutting
semiconductor wafer
strain
pellets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010678A
Other languages
English (en)
Inventor
Hisao Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2010678A priority Critical patent/JPS54112166A/ja
Publication of JPS54112166A publication Critical patent/JPS54112166A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)
JP2010678A 1978-02-22 1978-02-22 Method and device for cutting semiconductor wafer Pending JPS54112166A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010678A JPS54112166A (en) 1978-02-22 1978-02-22 Method and device for cutting semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010678A JPS54112166A (en) 1978-02-22 1978-02-22 Method and device for cutting semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS54112166A true JPS54112166A (en) 1979-09-01

Family

ID=12017851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010678A Pending JPS54112166A (en) 1978-02-22 1978-02-22 Method and device for cutting semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS54112166A (ja)

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