JPS54111535A - Bonding of two-part adhesive - Google Patents

Bonding of two-part adhesive

Info

Publication number
JPS54111535A
JPS54111535A JP2004678A JP2004678A JPS54111535A JP S54111535 A JPS54111535 A JP S54111535A JP 2004678 A JP2004678 A JP 2004678A JP 2004678 A JP2004678 A JP 2004678A JP S54111535 A JPS54111535 A JP S54111535A
Authority
JP
Japan
Prior art keywords
adhesive
curing agent
base
main
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004678A
Other languages
Japanese (ja)
Inventor
Kikuo Akai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP2004678A priority Critical patent/JPS54111535A/en
Publication of JPS54111535A publication Critical patent/JPS54111535A/en
Pending legal-status Critical Current

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: To effect bonding operation of a two-part adhesive with ease without fear of setting of the adhesive in a process of application, by applying a curing agent of the adhesive to the surface of a base or a material coated with a main constituent of the two-part adhesive, and by pressing the material to be coated against the base.
CONSTITUTION: The bond place 1' of the material 1 to be bonded is coated with the main constituent 3 of a two-liquid adhesive to form the layer of the main constituent 3, to which the curing agent 4 of the adhesive is applied to form the layer of the curing agent 4, on which the material 2 is placed. The material 2 and the base 1 are pressed by the downwards force so that the main agent 3 and the curing agent 4 are blended in the layer between the material 2 and the base 1, which are bonded by setting of the adhesive. The coating order of the main agent 3 and the curing agent 4 may be reveresed. The temperature of the bonded part of 35W80°C reduces the viscosity of epoxy resin, increases operating efficiency of coating, promotes blending of the main and curing agents, and improves bonding effects.
COPYRIGHT: (C)1979,JPO&Japio
JP2004678A 1978-02-20 1978-02-20 Bonding of two-part adhesive Pending JPS54111535A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004678A JPS54111535A (en) 1978-02-20 1978-02-20 Bonding of two-part adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004678A JPS54111535A (en) 1978-02-20 1978-02-20 Bonding of two-part adhesive

Publications (1)

Publication Number Publication Date
JPS54111535A true JPS54111535A (en) 1979-08-31

Family

ID=12016108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004678A Pending JPS54111535A (en) 1978-02-20 1978-02-20 Bonding of two-part adhesive

Country Status (1)

Country Link
JP (1) JPS54111535A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01180732A (en) * 1987-12-26 1989-07-18 Shiseido Co Ltd Manufacture of pressure container

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01180732A (en) * 1987-12-26 1989-07-18 Shiseido Co Ltd Manufacture of pressure container

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