JPS54105469A - Automatic wire bonding unit - Google Patents

Automatic wire bonding unit

Info

Publication number
JPS54105469A
JPS54105469A JP1285978A JP1285978A JPS54105469A JP S54105469 A JPS54105469 A JP S54105469A JP 1285978 A JP1285978 A JP 1285978A JP 1285978 A JP1285978 A JP 1285978A JP S54105469 A JPS54105469 A JP S54105469A
Authority
JP
Japan
Prior art keywords
square pattern
pattern
circumference
sensor
discriminating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1285978A
Other languages
Japanese (ja)
Inventor
Yutaka Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1285978A priority Critical patent/JPS54105469A/en
Publication of JPS54105469A publication Critical patent/JPS54105469A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/789—Means for monitoring the connection process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To make an accurate wire connection by discriminating the position of a straight line near the circumference of a semiconductor element by detecting the line by a photo sensor.
CONSTITUTION: Photo sensors 33 and 34 are combined optically by mirror 35 and arranged at right angles. Beltlike square pattern 36 is provided near the circumference of element 31 and optically made different in contrast from the circumference. As a result, sensors can obtain as outputs (a) and (b) (b3) and (b4), and (a2) and (a3) in addition to outputs by element electrodes 37 and 38. Those are different from an output by an electrode pattern and constant unless the one-dimentional sensor is in the square pattern. For the purpose, center intervals T1 to T3, T4 and T5 are measured to find the combinational sum, so that since the magnification of optical system 32 and the size of square pattern 36 are previously determined, pattern 36 can be identified easily. In this way, the position is detected and a tool is moved to make a line connection. If there is a substitute for the square pattern near the element, the rise of the sensor is detected without any square pattern, thereby discriminating the position.
COPYRIGHT: (C)1979,JPO&Japio
JP1285978A 1978-02-06 1978-02-06 Automatic wire bonding unit Pending JPS54105469A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1285978A JPS54105469A (en) 1978-02-06 1978-02-06 Automatic wire bonding unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1285978A JPS54105469A (en) 1978-02-06 1978-02-06 Automatic wire bonding unit

Publications (1)

Publication Number Publication Date
JPS54105469A true JPS54105469A (en) 1979-08-18

Family

ID=11817127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1285978A Pending JPS54105469A (en) 1978-02-06 1978-02-06 Automatic wire bonding unit

Country Status (1)

Country Link
JP (1) JPS54105469A (en)

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