JPS539594B2 - - Google Patents

Info

Publication number
JPS539594B2
JPS539594B2 JP4715974A JP4715974A JPS539594B2 JP S539594 B2 JPS539594 B2 JP S539594B2 JP 4715974 A JP4715974 A JP 4715974A JP 4715974 A JP4715974 A JP 4715974A JP S539594 B2 JPS539594 B2 JP S539594B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4715974A
Other languages
Japanese (ja)
Other versions
JPS5013275A (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5013275A publication Critical patent/JPS5013275A/ja
Publication of JPS539594B2 publication Critical patent/JPS539594B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP4715974A 1973-04-27 1974-04-27 Expired JPS539594B2 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2018473A GB1443827A (en) 1973-04-27 1973-04-27 Reactive sputtering apparatus and cathode units therefor

Publications (2)

Publication Number Publication Date
JPS5013275A JPS5013275A (enrdf_load_stackoverflow) 1975-02-12
JPS539594B2 true JPS539594B2 (enrdf_load_stackoverflow) 1978-04-06

Family

ID=10141798

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4715974A Expired JPS539594B2 (enrdf_load_stackoverflow) 1973-04-27 1974-04-27

Country Status (13)

Country Link
US (1) US3890217A (enrdf_load_stackoverflow)
JP (1) JPS539594B2 (enrdf_load_stackoverflow)
BE (1) BE814286A (enrdf_load_stackoverflow)
CA (1) CA1024937A (enrdf_load_stackoverflow)
CH (1) CH590936A5 (enrdf_load_stackoverflow)
DE (1) DE2418008A1 (enrdf_load_stackoverflow)
FR (1) FR2227345B1 (enrdf_load_stackoverflow)
GB (1) GB1443827A (enrdf_load_stackoverflow)
IT (1) IT1010755B (enrdf_load_stackoverflow)
NL (1) NL7404891A (enrdf_load_stackoverflow)
SE (1) SE408913B (enrdf_load_stackoverflow)
SU (1) SU764619A3 (enrdf_load_stackoverflow)
ZA (1) ZA742375B (enrdf_load_stackoverflow)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3945911A (en) * 1974-08-28 1976-03-23 Shatterproof Glass Corporation Cathodes for sputter-coating glass sheets or other substrates
US3976555A (en) * 1975-03-20 1976-08-24 Coulter Information Systems, Inc. Method and apparatus for supplying background gas in a sputtering chamber
US4009090A (en) * 1975-12-03 1977-02-22 Shatterproof Glass Corporation Sputter-coating of glass sheets or other substrates
FR2403645A2 (fr) * 1977-09-14 1979-04-13 Vide & Traitement Sa Four pour le traitement thermochimique, en continu, de pieces metalliques, par bombardement ionique
US4116806A (en) * 1977-12-08 1978-09-26 Battelle Development Corporation Two-sided planar magnetron sputtering apparatus
US4175030A (en) * 1977-12-08 1979-11-20 Battelle Development Corporation Two-sided planar magnetron sputtering apparatus
JPS57111031A (en) * 1980-12-27 1982-07-10 Clarion Co Ltd Sputtering device
US4362611A (en) * 1981-07-27 1982-12-07 International Business Machines Corporation Quadrupole R.F. sputtering system having an anode/cathode shield and a floating target shield
US4420385A (en) * 1983-04-15 1983-12-13 Gryphon Products Apparatus and process for sputter deposition of reacted thin films
US4526670A (en) * 1983-05-20 1985-07-02 Lfe Corporation Automatically loadable multifaceted electrode with load lock mechanism
US20050211544A1 (en) * 2004-03-29 2005-09-29 Seagate Technology Llc Electrical biasing of gas introduction means of plasma apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3325394A (en) * 1963-07-01 1967-06-13 Ibm Magnetic control of film deposition
US3526584A (en) * 1964-09-25 1970-09-01 Western Electric Co Method of providing a field free region above a substrate during sputter-depositing thereon
US3369991A (en) * 1965-01-28 1968-02-20 Ibm Apparatus for cathode sputtering including a shielded rf electrode
US3361659A (en) * 1967-08-14 1968-01-02 Ibm Process of depositing thin films by cathode sputtering using a controlled grid
US3595775A (en) * 1969-05-15 1971-07-27 United Aircraft Corp Sputtering apparatus with sealed cathode-shield chamber

Also Published As

Publication number Publication date
AU6775774A (en) 1975-10-16
DE2418008A1 (de) 1974-11-21
IT1010755B (it) 1977-01-20
FR2227345B1 (enrdf_load_stackoverflow) 1977-10-14
GB1443827A (en) 1976-07-28
SE408913B (sv) 1979-07-16
ZA742375B (en) 1975-11-26
BE814286A (fr) 1974-10-28
US3890217A (en) 1975-06-17
NL7404891A (enrdf_load_stackoverflow) 1974-10-29
JPS5013275A (enrdf_load_stackoverflow) 1975-02-12
SU764619A3 (ru) 1980-09-15
CA1024937A (en) 1978-01-24
FR2227345A1 (enrdf_load_stackoverflow) 1974-11-22
CH590936A5 (enrdf_load_stackoverflow) 1977-08-31

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