JPS5355960A - Breaking method for semiconductor wafer - Google Patents

Breaking method for semiconductor wafer

Info

Publication number
JPS5355960A
JPS5355960A JP13108176A JP13108176A JPS5355960A JP S5355960 A JPS5355960 A JP S5355960A JP 13108176 A JP13108176 A JP 13108176A JP 13108176 A JP13108176 A JP 13108176A JP S5355960 A JPS5355960 A JP S5355960A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
breaking method
wafer
breaking
ensuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13108176A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5642139B2 (cg-RX-API-DMAC7.html
Inventor
Chihiro Koike
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP13108176A priority Critical patent/JPS5355960A/ja
Publication of JPS5355960A publication Critical patent/JPS5355960A/ja
Publication of JPS5642139B2 publication Critical patent/JPS5642139B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)
JP13108176A 1976-10-29 1976-10-29 Breaking method for semiconductor wafer Granted JPS5355960A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13108176A JPS5355960A (en) 1976-10-29 1976-10-29 Breaking method for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13108176A JPS5355960A (en) 1976-10-29 1976-10-29 Breaking method for semiconductor wafer

Publications (2)

Publication Number Publication Date
JPS5355960A true JPS5355960A (en) 1978-05-20
JPS5642139B2 JPS5642139B2 (cg-RX-API-DMAC7.html) 1981-10-02

Family

ID=15049536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13108176A Granted JPS5355960A (en) 1976-10-29 1976-10-29 Breaking method for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5355960A (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6383044U (cg-RX-API-DMAC7.html) * 1986-10-01 1988-05-31

Also Published As

Publication number Publication date
JPS5642139B2 (cg-RX-API-DMAC7.html) 1981-10-02

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