JPS5347768A - Wedge for ultrasonic wire bonder - Google Patents

Wedge for ultrasonic wire bonder

Info

Publication number
JPS5347768A
JPS5347768A JP12192576A JP12192576A JPS5347768A JP S5347768 A JPS5347768 A JP S5347768A JP 12192576 A JP12192576 A JP 12192576A JP 12192576 A JP12192576 A JP 12192576A JP S5347768 A JPS5347768 A JP S5347768A
Authority
JP
Japan
Prior art keywords
wedge
wire bonder
ultrasonic wire
wire
ultrasonic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12192576A
Other languages
Japanese (ja)
Other versions
JPS6020894B2 (en
Inventor
Shunichiro Fujioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP51121925A priority Critical patent/JPS6020894B2/en
Publication of JPS5347768A publication Critical patent/JPS5347768A/en
Publication of JPS6020894B2 publication Critical patent/JPS6020894B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To produce an ultrasonic wedge free from play and compression bonding deviation of a wire by prolonging and forming a wire guide way down to the position reaching wire pressing surface.
COPYRIGHT: (C)1978,JPO&Japio
JP51121925A 1976-10-13 1976-10-13 Wedge for ultrasonic wire bonder Expired JPS6020894B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51121925A JPS6020894B2 (en) 1976-10-13 1976-10-13 Wedge for ultrasonic wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51121925A JPS6020894B2 (en) 1976-10-13 1976-10-13 Wedge for ultrasonic wire bonder

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP58172942A Division JPS59130435A (en) 1983-09-21 1983-09-21 Wedge for supersonic wire bonder

Publications (2)

Publication Number Publication Date
JPS5347768A true JPS5347768A (en) 1978-04-28
JPS6020894B2 JPS6020894B2 (en) 1985-05-24

Family

ID=14823304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51121925A Expired JPS6020894B2 (en) 1976-10-13 1976-10-13 Wedge for ultrasonic wire bonder

Country Status (1)

Country Link
JP (1) JPS6020894B2 (en)

Also Published As

Publication number Publication date
JPS6020894B2 (en) 1985-05-24

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