JPS5343890B2 - - Google Patents

Info

Publication number
JPS5343890B2
JPS5343890B2 JP10209572A JP10209572A JPS5343890B2 JP S5343890 B2 JPS5343890 B2 JP S5343890B2 JP 10209572 A JP10209572 A JP 10209572A JP 10209572 A JP10209572 A JP 10209572A JP S5343890 B2 JPS5343890 B2 JP S5343890B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10209572A
Other versions
JPS4959042A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10209572A priority Critical patent/JPS5343890B2/ja
Publication of JPS4959042A publication Critical patent/JPS4959042A/ja
Publication of JPS5343890B2 publication Critical patent/JPS5343890B2/ja
Expired legal-status Critical Current

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  • Chemically Coating (AREA)
JP10209572A 1972-10-12 1972-10-12 Expired JPS5343890B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10209572A JPS5343890B2 (ja) 1972-10-12 1972-10-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10209572A JPS5343890B2 (ja) 1972-10-12 1972-10-12

Publications (2)

Publication Number Publication Date
JPS4959042A JPS4959042A (ja) 1974-06-07
JPS5343890B2 true JPS5343890B2 (ja) 1978-11-24

Family

ID=14318205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10209572A Expired JPS5343890B2 (ja) 1972-10-12 1972-10-12

Country Status (1)

Country Link
JP (1) JPS5343890B2 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
JPH0723539B2 (ja) * 1986-11-06 1995-03-15 日本電装株式会社 化学銅めっき液及びそれを用いた銅めっき皮膜の形成方法
JPS6452081A (en) * 1987-05-08 1989-02-28 Nippon Denso Co Chemical copper plating solution and its plating method
JP2595319B2 (ja) * 1988-07-20 1997-04-02 日本電装株式会社 化学銅めっき液及びそれを用いた銅めっき皮膜の形成方法
JPH036383A (ja) * 1989-06-02 1991-01-11 Nippondenso Co Ltd 化学銅めっき液

Also Published As

Publication number Publication date
JPS4959042A (ja) 1974-06-07

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