JPS5329579B2 - - Google Patents

Info

Publication number
JPS5329579B2
JPS5329579B2 JP9605776A JP9605776A JPS5329579B2 JP S5329579 B2 JPS5329579 B2 JP S5329579B2 JP 9605776 A JP9605776 A JP 9605776A JP 9605776 A JP9605776 A JP 9605776A JP S5329579 B2 JPS5329579 B2 JP S5329579B2
Authority
JP
Japan
Prior art keywords
ech
solder
region
multiplicity
lamination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9605776A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5322373A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9605776A priority Critical patent/JPS5322373A/ja
Publication of JPS5322373A publication Critical patent/JPS5322373A/ja
Publication of JPS5329579B2 publication Critical patent/JPS5329579B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP9605776A 1976-08-13 1976-08-13 Solder d isc feeder to wafers Granted JPS5322373A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9605776A JPS5322373A (en) 1976-08-13 1976-08-13 Solder d isc feeder to wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9605776A JPS5322373A (en) 1976-08-13 1976-08-13 Solder d isc feeder to wafers

Publications (2)

Publication Number Publication Date
JPS5322373A JPS5322373A (en) 1978-03-01
JPS5329579B2 true JPS5329579B2 (da) 1978-08-22

Family

ID=14154805

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9605776A Granted JPS5322373A (en) 1976-08-13 1976-08-13 Solder d isc feeder to wafers

Country Status (1)

Country Link
JP (1) JPS5322373A (da)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63129102U (da) * 1987-02-17 1988-08-24

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19982176B4 (de) 1998-10-02 2007-01-18 Mitsubishi Heavy Industries, Ltd. Flüssigkeitsabzugsvorrichtung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63129102U (da) * 1987-02-17 1988-08-24

Also Published As

Publication number Publication date
JPS5322373A (en) 1978-03-01

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