JPS5328342B2 - - Google Patents
Info
- Publication number
- JPS5328342B2 JPS5328342B2 JP9817975A JP9817975A JPS5328342B2 JP S5328342 B2 JPS5328342 B2 JP S5328342B2 JP 9817975 A JP9817975 A JP 9817975A JP 9817975 A JP9817975 A JP 9817975A JP S5328342 B2 JPS5328342 B2 JP S5328342B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/071—Manufacture or treatment of dielectric parts thereof
- H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
- H10W20/082—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts the openings being tapered via holes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/68—Organic materials, e.g. photoresists
- H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
- H10P50/286—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials
- H10P50/287—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials by chemical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
Landscapes
- Weting (AREA)
- Formation Of Insulating Films (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50098179A JPS5222071A (en) | 1975-08-13 | 1975-08-13 | Method of selective etching of film of polyamide resin |
| NL7604652A NL7604652A (nl) | 1975-08-13 | 1976-04-29 | Werkwijze voor de vervaardiging van halfgelei- ders. |
| DE2618937A DE2618937C3 (de) | 1975-08-13 | 1976-04-29 | Ätzmittel für Polymerisatharze, insbesondere für die Halbleiterherstellung, und Verfahren zur Herstellung von Halbleiterbauelementen unter Verwendung dieses Ätzmittels |
| GB17720/76A GB1510944A (en) | 1975-08-13 | 1976-04-30 | Method for fabricating semiconductor device and etchant for polymer resin |
| FR7613338A FR2321190A1 (fr) | 1975-08-13 | 1976-05-05 | Composant semi-conducteur et son procede de fabrication |
| US05/695,040 US4113550A (en) | 1974-08-23 | 1976-06-11 | Method for fabricating semiconductor device and etchant for polymer resin |
| US05/924,008 US4218283A (en) | 1974-08-23 | 1978-07-12 | Method for fabricating semiconductor device and etchant for polymer resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50098179A JPS5222071A (en) | 1975-08-13 | 1975-08-13 | Method of selective etching of film of polyamide resin |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5151979A Division JPS557880A (en) | 1979-04-27 | 1979-04-27 | Etching solution for organic resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5222071A JPS5222071A (en) | 1977-02-19 |
| JPS5328342B2 true JPS5328342B2 (show.php) | 1978-08-14 |
Family
ID=14212791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50098179A Granted JPS5222071A (en) | 1974-08-23 | 1975-08-13 | Method of selective etching of film of polyamide resin |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS5222071A (show.php) |
| DE (1) | DE2618937C3 (show.php) |
| FR (1) | FR2321190A1 (show.php) |
| GB (1) | GB1510944A (show.php) |
| NL (1) | NL7604652A (show.php) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54106599A (en) * | 1978-02-09 | 1979-08-21 | Hitachi Chem Co Ltd | Preparation of polyamide intermediate for semiconductor processing |
| JPS54179102U (show.php) * | 1978-06-07 | 1979-12-18 | ||
| JPS5515502A (en) * | 1978-07-18 | 1980-02-02 | Hitachi Ltd | Running control system for manless wagon |
| JPS557880A (en) * | 1979-04-27 | 1980-01-21 | Hitachi Ltd | Etching solution for organic resin |
| JPS58108229A (ja) * | 1981-12-21 | 1983-06-28 | Hitachi Ltd | ポリイミド系樹脂膜の選択エツチング方法 |
| FR2550660B2 (fr) * | 1982-04-14 | 1987-11-06 | Commissariat Energie Atomique | Perfectionnement au procede de positionnement d'une ligne d'interconnexion sur un trou de contact electrique d'un circuit integre |
| FR2525389A1 (fr) * | 1982-04-14 | 1983-10-21 | Commissariat Energie Atomique | Procede de positionnement d'une ligne d'interconnexion sur un trou de contact electrique d'un circuit integre |
| FR2537779B1 (fr) * | 1982-12-10 | 1986-03-14 | Commissariat Energie Atomique | Procede de positionnement d'un trou de contact electrique entre deux lignes d'interconnexion d'un circuit integre |
| DE3475856D1 (en) * | 1983-08-12 | 1989-02-02 | Commissariat Energie Atomique | Method for aligning a connecting line above an electrical contact hole of an integrated circuit |
| EP0511691A3 (en) * | 1988-07-13 | 1993-03-03 | International Business Machines Corporation | Wet etching of cured polyimide |
| JP3586468B2 (ja) | 1995-01-17 | 2004-11-10 | 新日鐵化学株式会社 | 積層体 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49120504A (show.php) * | 1973-03-16 | 1974-11-18 |
-
1975
- 1975-08-13 JP JP50098179A patent/JPS5222071A/ja active Granted
-
1976
- 1976-04-29 NL NL7604652A patent/NL7604652A/xx not_active Application Discontinuation
- 1976-04-29 DE DE2618937A patent/DE2618937C3/de not_active Expired
- 1976-04-30 GB GB17720/76A patent/GB1510944A/en not_active Expired
- 1976-05-05 FR FR7613338A patent/FR2321190A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| DE2618937A1 (de) | 1977-02-17 |
| FR2321190A1 (fr) | 1977-03-11 |
| FR2321190B1 (show.php) | 1979-08-17 |
| GB1510944A (en) | 1978-05-17 |
| DE2618937B2 (de) | 1978-06-29 |
| NL7604652A (nl) | 1977-02-15 |
| JPS5222071A (en) | 1977-02-19 |
| DE2618937C3 (de) | 1979-02-22 |