JPS5325996A - Laser working method - Google Patents

Laser working method

Info

Publication number
JPS5325996A
JPS5325996A JP10093576A JP10093576A JPS5325996A JP S5325996 A JPS5325996 A JP S5325996A JP 10093576 A JP10093576 A JP 10093576A JP 10093576 A JP10093576 A JP 10093576A JP S5325996 A JPS5325996 A JP S5325996A
Authority
JP
Japan
Prior art keywords
working method
laser working
groove
switching
working
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10093576A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5512348B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Masatoshi Kawada
Tomohiro Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP10093576A priority Critical patent/JPS5325996A/ja
Publication of JPS5325996A publication Critical patent/JPS5325996A/ja
Publication of JPS5512348B2 publication Critical patent/JPS5512348B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
JP10093576A 1976-08-24 1976-08-24 Laser working method Granted JPS5325996A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10093576A JPS5325996A (en) 1976-08-24 1976-08-24 Laser working method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10093576A JPS5325996A (en) 1976-08-24 1976-08-24 Laser working method

Publications (2)

Publication Number Publication Date
JPS5325996A true JPS5325996A (en) 1978-03-10
JPS5512348B2 JPS5512348B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1980-04-01

Family

ID=14287198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10093576A Granted JPS5325996A (en) 1976-08-24 1976-08-24 Laser working method

Country Status (1)

Country Link
JP (1) JPS5325996A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63224270A (ja) * 1987-11-11 1988-09-19 Semiconductor Energy Lab Co Ltd 超伝導コイルの作製方法
JPS63250881A (ja) * 1987-04-07 1988-10-18 Semiconductor Energy Lab Co Ltd 超電導体の作製方法
JPS63269586A (ja) * 1987-04-27 1988-11-07 Fujikura Ltd ブリツジ型ジヨセフソン接合素子の製造方法
US5719372A (en) * 1994-11-17 1998-02-17 Nec Corporation Laser marking system and method using controlled pulse width of Q-switch
JP2004009139A (ja) * 2002-06-10 2004-01-15 New Wave Research ダイを製造する方法及びシステム
US7052976B2 (en) 2002-11-05 2006-05-30 New Wave Research Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure
US7112518B2 (en) 2002-06-10 2006-09-26 New Wave Research Method and apparatus for cutting devices from substrates

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5998763U (ja) * 1982-12-24 1984-07-04 池田　正躬 水耕栽培用の容器

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63250881A (ja) * 1987-04-07 1988-10-18 Semiconductor Energy Lab Co Ltd 超電導体の作製方法
JPS63269586A (ja) * 1987-04-27 1988-11-07 Fujikura Ltd ブリツジ型ジヨセフソン接合素子の製造方法
JPS63224270A (ja) * 1987-11-11 1988-09-19 Semiconductor Energy Lab Co Ltd 超伝導コイルの作製方法
US5719372A (en) * 1994-11-17 1998-02-17 Nec Corporation Laser marking system and method using controlled pulse width of Q-switch
JP2004009139A (ja) * 2002-06-10 2004-01-15 New Wave Research ダイを製造する方法及びシステム
US7112518B2 (en) 2002-06-10 2006-09-26 New Wave Research Method and apparatus for cutting devices from substrates
US7169688B2 (en) 2002-06-10 2007-01-30 New Wave Research, Inc. Method and apparatus for cutting devices from substrates
US8822882B2 (en) 2002-06-10 2014-09-02 New Wave Research Scribing sapphire substrates with a solid state UV laser with edge detection
US7052976B2 (en) 2002-11-05 2006-05-30 New Wave Research Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure

Also Published As

Publication number Publication date
JPS5512348B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1980-04-01

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