JPS5512348B2 - - Google Patents
Info
- Publication number
- JPS5512348B2 JPS5512348B2 JP10093576A JP10093576A JPS5512348B2 JP S5512348 B2 JPS5512348 B2 JP S5512348B2 JP 10093576 A JP10093576 A JP 10093576A JP 10093576 A JP10093576 A JP 10093576A JP S5512348 B2 JPS5512348 B2 JP S5512348B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10093576A JPS5325996A (en) | 1976-08-24 | 1976-08-24 | Laser working method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10093576A JPS5325996A (en) | 1976-08-24 | 1976-08-24 | Laser working method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5325996A JPS5325996A (en) | 1978-03-10 |
| JPS5512348B2 true JPS5512348B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1980-04-01 |
Family
ID=14287198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10093576A Granted JPS5325996A (en) | 1976-08-24 | 1976-08-24 | Laser working method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5325996A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5998763U (ja) * | 1982-12-24 | 1984-07-04 | 池田 正躬 | 水耕栽培用の容器 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07114295B2 (ja) * | 1987-11-11 | 1995-12-06 | 株式会社半導体エネルギー研究所 | 超伝導コイルの作製方法 |
| JPS63250881A (ja) * | 1987-04-07 | 1988-10-18 | Semiconductor Energy Lab Co Ltd | 超電導体の作製方法 |
| JPS63269586A (ja) * | 1987-04-27 | 1988-11-07 | Fujikura Ltd | ブリツジ型ジヨセフソン接合素子の製造方法 |
| JP2682475B2 (ja) * | 1994-11-17 | 1997-11-26 | 日本電気株式会社 | ビームスキャン式レーザマーキング方法および装置 |
| US6806544B2 (en) | 2002-11-05 | 2004-10-19 | New Wave Research | Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure |
| US6960813B2 (en) | 2002-06-10 | 2005-11-01 | New Wave Research | Method and apparatus for cutting devices from substrates |
| US6580054B1 (en) | 2002-06-10 | 2003-06-17 | New Wave Research | Scribing sapphire substrates with a solid state UV laser |
-
1976
- 1976-08-24 JP JP10093576A patent/JPS5325996A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5998763U (ja) * | 1982-12-24 | 1984-07-04 | 池田 正躬 | 水耕栽培用の容器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5325996A (en) | 1978-03-10 |