JPS5320860A - Hermetic sealing method of electronic parts - Google Patents
Hermetic sealing method of electronic partsInfo
- Publication number
- JPS5320860A JPS5320860A JP9486176A JP9486176A JPS5320860A JP S5320860 A JPS5320860 A JP S5320860A JP 9486176 A JP9486176 A JP 9486176A JP 9486176 A JP9486176 A JP 9486176A JP S5320860 A JPS5320860 A JP S5320860A
- Authority
- JP
- Japan
- Prior art keywords
- hermetic sealing
- electronic parts
- sealing method
- outside
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9486176A JPS5320860A (en) | 1976-08-11 | 1976-08-11 | Hermetic sealing method of electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9486176A JPS5320860A (en) | 1976-08-11 | 1976-08-11 | Hermetic sealing method of electronic parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5320860A true JPS5320860A (en) | 1978-02-25 |
Family
ID=14121804
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9486176A Pending JPS5320860A (en) | 1976-08-11 | 1976-08-11 | Hermetic sealing method of electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5320860A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0203589A2 (en) * | 1985-05-31 | 1986-12-03 | Hitachi, Ltd. | Method and apparatus for airtightly packaging semiconductor package |
JPH05235189A (ja) * | 1992-02-24 | 1993-09-10 | Nec Corp | 半導体製造方法及びその装置 |
-
1976
- 1976-08-11 JP JP9486176A patent/JPS5320860A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0203589A2 (en) * | 1985-05-31 | 1986-12-03 | Hitachi, Ltd. | Method and apparatus for airtightly packaging semiconductor package |
US4836434A (en) * | 1985-05-31 | 1989-06-06 | Hitachi, Ltd. | Method and apparatus for airtightly packaging semiconductor package |
JPH05235189A (ja) * | 1992-02-24 | 1993-09-10 | Nec Corp | 半導体製造方法及びその装置 |
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