JPS5317554B1 - - Google Patents

Info

Publication number
JPS5317554B1
JPS5317554B1 JP7642271A JP7642271A JPS5317554B1 JP S5317554 B1 JPS5317554 B1 JP S5317554B1 JP 7642271 A JP7642271 A JP 7642271A JP 7642271 A JP7642271 A JP 7642271A JP S5317554 B1 JPS5317554 B1 JP S5317554B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7642271A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5317554B1 publication Critical patent/JPS5317554B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3311—Horizontal transfer of a batch of workpieces
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP7642271A 1970-11-23 1971-10-01 Pending JPS5317554B1 (oth)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US9235970A 1970-11-23 1970-11-23

Publications (1)

Publication Number Publication Date
JPS5317554B1 true JPS5317554B1 (oth) 1978-06-09

Family

ID=22232846

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7642271A Pending JPS5317554B1 (oth) 1970-11-23 1971-10-01

Country Status (2)

Country Link
US (1) US3656454A (oth)
JP (1) JPS5317554B1 (oth)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3894926A (en) * 1973-02-09 1975-07-15 Lee Jau Yien In-out transporter for an enclosed chamber
JPS5315466B2 (oth) * 1973-04-28 1978-05-25
US4030622A (en) * 1975-05-23 1977-06-21 Pass-Port Systems, Inc. Wafer transport system
US4047624A (en) * 1975-10-21 1977-09-13 Airco, Inc. Workpiece handling system for vacuum processing
US4002141A (en) * 1975-11-26 1977-01-11 Airco, Inc. System for handling substrate holders for vacuum coating
DE2812271C2 (de) * 1978-03-21 1983-01-27 Leybold-Heraeus GmbH, 5000 Köln Vorrichtung mit mehreren Schleusenkammern zum chargenweisen Beschichten von Substraten
US4212317A (en) * 1978-08-02 1980-07-15 The United States Of America As Represented By The Secretary Of The Army Vacuum interlock
FR2465007A1 (fr) * 1979-09-17 1981-03-20 Leybold Heraeus Gmbh & Co Kg Dispositif a plusieurs sas pour revetir sous vide des charges successives de substrats
DE2940064A1 (de) * 1979-10-03 1981-04-16 Leybold-Heraeus GmbH, 5000 Köln Vakuumaufdampfanlage mir einer ventilkammer, einer bedampfungskammer und einer verdampferkammer
US4487162A (en) * 1980-11-25 1984-12-11 Cann Gordon L Magnetoplasmadynamic apparatus for the separation and deposition of materials
US4433951A (en) 1981-02-13 1984-02-28 Lam Research Corporation Modular loadlock
FR2502643B1 (fr) * 1981-03-27 1986-05-02 Western Electric Co Appareil et procede de depot par jet moleculaire sur plusieurs substrats
DE3214256A1 (de) * 1982-04-17 1983-10-20 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Vorrichtung zur handhabung eines substrates
US4498832A (en) * 1982-05-21 1985-02-12 The Boc Group, Inc. Workpiece accumulating and transporting apparatus
US4495966A (en) * 1982-05-24 1985-01-29 Electron Beam Corporation Separable high vacuum valve
DE3276333D1 (en) * 1982-10-28 1987-06-19 Ibm Method and apparatus for vacuum evaporation coating using an electron gun
JPS59222922A (ja) * 1983-06-01 1984-12-14 Nippon Telegr & Teleph Corp <Ntt> 気相成長装置
US4576828A (en) * 1984-05-17 1986-03-18 Geotel, Inc. Method and apparatus for plasma spray coating
US4518846A (en) * 1984-06-11 1985-05-21 International Business Machines Corporation Heater assembly for molecular beam epitaxy furnace
US4753417A (en) * 1985-01-28 1988-06-28 The Boc Group, Inc. Gate valve for vacuum processing apparatus
JPS61239624A (ja) * 1985-04-16 1986-10-24 Toshiba Mach Co Ltd ロ−デイング装置およびロ−デイング方法
JPS61291032A (ja) * 1985-06-17 1986-12-20 Fujitsu Ltd 真空装置
US4909695A (en) * 1986-04-04 1990-03-20 Materials Research Corporation Method and apparatus for handling and processing wafer-like materials
US4764076A (en) * 1986-04-17 1988-08-16 Varian Associates, Inc. Valve incorporating wafer handling arm
US4715764A (en) * 1986-04-28 1987-12-29 Varian Associates, Inc. Gate valve for wafer processing system
US4728252A (en) * 1986-08-22 1988-03-01 Lam Research Corporation Wafer transport mechanism
US5044314A (en) * 1986-10-15 1991-09-03 Advantage Production Technology, Inc. Semiconductor wafer processing apparatus
JP2859632B2 (ja) * 1988-04-14 1999-02-17 キヤノン株式会社 成膜装置及び成膜方法
US5186594A (en) * 1990-04-19 1993-02-16 Applied Materials, Inc. Dual cassette load lock
TW283250B (en) * 1995-07-10 1996-08-11 Watkins Johnson Co Plasma enhanced chemical processing reactor and method
DE19537092C1 (de) * 1995-10-05 1996-07-11 Ardenne Anlagentech Gmbh Elektronenstrahl-Bedampfungsanlage im Durchlaufbetrieb für thermisch hoch belastete Substrate
US6286451B1 (en) * 1997-05-29 2001-09-11 Applied Materials, Inc. Dome: shape and temperature controlled surfaces
US6073366A (en) 1997-07-11 2000-06-13 Asm America, Inc. Substrate cooling system and method
US6957690B1 (en) 1998-09-10 2005-10-25 Asm America, Inc. Apparatus for thermal treatment of substrates
US6108937A (en) * 1998-09-10 2000-08-29 Asm America, Inc. Method of cooling wafers
US6391387B1 (en) 1998-11-25 2002-05-21 Preferred Machining Corporation Pivoting fluid dispensing method
UA70336C2 (uk) * 1999-08-04 2004-10-15 Дженерал Електрік Компані Електронно-променевий пристрій для нанесення покриття конденсацією із парової фази (варіанти)
US6902623B2 (en) * 2001-06-07 2005-06-07 Veeco Instruments Inc. Reactor having a movable shutter
US6923868B2 (en) * 2003-09-23 2005-08-02 Gba S.A. Installation for electron-ray coatication of coatings
TWI394242B (zh) * 2004-05-14 2013-04-21 費洛鐵股份有限公司 轉移物件通過低壓狀態下之負荷固定艙的裝置及方法
US20060177288A1 (en) * 2005-02-09 2006-08-10 Parker N W Multiple loadlocks and processing chamber
US20090078199A1 (en) * 2007-09-21 2009-03-26 Innovation Vacuum Technology Co., Ltd. Plasma enhanced chemical vapor deposition apparatus
US8404047B2 (en) * 2008-09-16 2013-03-26 United Technologies Corporation Electron beam vapor deposition apparatus and method
US20100127201A1 (en) * 2008-11-21 2010-05-27 Applied Materials, Inc. Interlocking valve chamber and lid
US20120207973A1 (en) * 2011-02-15 2012-08-16 Canon Kabushiki Kaisha Optical member, method of manufacturing the same, and optical system using the same
EP2518178B1 (en) * 2011-04-29 2014-01-01 Applied Materials, Inc. Tooling carrier for inline coating machine, method of operating thereof and process of coating a substrate
TWI654666B (zh) 2014-01-27 2019-03-21 Veeco Instruments, Inc. 用於化學氣相沉積系統之具有複合半徑容置腔的晶圓載具
JP6333112B2 (ja) * 2014-08-20 2018-05-30 東京エレクトロン株式会社 ウエハ検査装置
RU2586937C1 (ru) * 2014-11-25 2016-06-10 ОАО "Научно-исследовательский институт электронных приборов" Способ напыления в вакууме топологического тонкоплёночного рисунка гибридной микросхемы на подложку
WO2016092007A1 (en) * 2014-12-11 2016-06-16 Evatec Ag Chamber for degassing substrates
US20230204821A1 (en) * 2015-06-16 2023-06-29 Schneider Gmbh & Co. Kg Device, method and use for the coating of lenses
KR102345172B1 (ko) 2016-03-08 2021-12-31 에바텍 아크티엔게젤샤프트 기판 탈가스용 챔버
DE102017109820B4 (de) * 2017-04-26 2024-03-28 VON ARDENNE Asset GmbH & Co. KG Vakuumkammeranordnung und deren Verwendung
CN110745612B (zh) * 2018-07-24 2021-05-14 鸿翌科技有限公司 卷绕系统

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2463906A (en) * 1944-04-20 1949-03-08 American Optical Corp Apparatus and method for making optical devices
CH311812A (de) * 1951-11-05 1955-12-15 Zeiss Carl Fa Aufdampfeinrichtung.
US3206322A (en) * 1960-10-31 1965-09-14 Morgan John Robert Vacuum deposition means and methods for manufacture of electronic components
NL285523A (oth) * 1961-11-24
US3381947A (en) * 1965-09-20 1968-05-07 Midland Ross Corp Furnace vestibule having a movable ceiling
US3469560A (en) * 1966-05-04 1969-09-30 Sperry Rand Corp Continuous vacuum deposition apparatus
US3568632A (en) * 1969-03-24 1971-03-09 Gary F Cawthon Lens coating apparatus

Also Published As

Publication number Publication date
US3656454A (en) 1972-04-18

Similar Documents

Publication Publication Date Title
ATA96471A (oth)
AU1473870A (oth)
AU2044470A (oth)
AU1146470A (oth)
AU2017870A (oth)
AU2085370A (oth)
AU2130570A (oth)
AR195465A1 (oth)
AU2131570A (oth)
AU1064870A (oth)
AU1277070A (oth)
AU1841070A (oth)
AU1872870A (oth)
AU1879170A (oth)
AU1943370A (oth)
AU1004470A (oth)
AU1881070A (oth)
AU1247570A (oth)
AU1235770A (oth)
AU1918570A (oth)
AU2333670A (oth)
AU2144270A (oth)
AU1189670A (oth)
AU1969370A (oth)
AU1974970A (oth)