JPS53147637A - Etching method and apparatus for same - Google Patents

Etching method and apparatus for same

Info

Publication number
JPS53147637A
JPS53147637A JP6368677A JP6368677A JPS53147637A JP S53147637 A JPS53147637 A JP S53147637A JP 6368677 A JP6368677 A JP 6368677A JP 6368677 A JP6368677 A JP 6368677A JP S53147637 A JPS53147637 A JP S53147637A
Authority
JP
Japan
Prior art keywords
same
etching method
moleculaes
hitting
incidence
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6368677A
Other languages
Japanese (ja)
Other versions
JPS6031908B2 (en
Inventor
Seiichi Nagata
Tsuneo Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP6368677A priority Critical patent/JPS6031908B2/en
Publication of JPS53147637A publication Critical patent/JPS53147637A/en
Publication of JPS6031908B2 publication Critical patent/JPS6031908B2/en
Expired legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE: To accomplish ultra fine working by hitting a work with chemically active atoms, moleculaes or gases excited to ions in a specific direction of incidence so as to prevent side etching.
COPYRIGHT: (C)1978,JPO&Japio
JP6368677A 1977-05-30 1977-05-30 Etching method and etching device Expired JPS6031908B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6368677A JPS6031908B2 (en) 1977-05-30 1977-05-30 Etching method and etching device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6368677A JPS6031908B2 (en) 1977-05-30 1977-05-30 Etching method and etching device

Publications (2)

Publication Number Publication Date
JPS53147637A true JPS53147637A (en) 1978-12-22
JPS6031908B2 JPS6031908B2 (en) 1985-07-25

Family

ID=13236494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6368677A Expired JPS6031908B2 (en) 1977-05-30 1977-05-30 Etching method and etching device

Country Status (1)

Country Link
JP (1) JPS6031908B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5693328A (en) * 1979-12-26 1981-07-28 Nec Corp Formation of mask pattern
JPS58202533A (en) * 1982-05-21 1983-11-25 Hitachi Ltd Surface treatment device
JPS59135730A (en) * 1983-01-24 1984-08-04 Hitachi Ltd Device for surface modification

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5693328A (en) * 1979-12-26 1981-07-28 Nec Corp Formation of mask pattern
JPS58202533A (en) * 1982-05-21 1983-11-25 Hitachi Ltd Surface treatment device
JPH0542813B2 (en) * 1982-05-21 1993-06-29 Hitachi Ltd
JPS59135730A (en) * 1983-01-24 1984-08-04 Hitachi Ltd Device for surface modification

Also Published As

Publication number Publication date
JPS6031908B2 (en) 1985-07-25

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